Invention Application
WO2016022125A1 METHOD AND APPARATUS FOR FORMING BACKSIDE DIE PLANAR DEVICES AND SAW FILTER
审中-公开
用于形成背面平面设备和SAW滤波器的方法和装置
- Patent Title: METHOD AND APPARATUS FOR FORMING BACKSIDE DIE PLANAR DEVICES AND SAW FILTER
- Patent Title (中): 用于形成背面平面设备和SAW滤波器的方法和装置
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Application No.: PCT/US2014/050134Application Date: 2014-08-07
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Publication No.: WO2016022125A1Publication Date: 2016-02-11
- Inventor: LEE, Kevin J. , SARASWAT, Ruchir , ZILLMANN, Uwe , COWLEY, Nicholas P. , GOLDMAN, Richard J.
- Applicant: INTEL CORPORATION , LEE, Kevin J. , SARASWAT, Ruchir , ZILLMANN, Uwe , COWLEY, Nicholas P. , GOLDMAN, Richard J.
- Applicant Address: 2200 Mission College Boulevard Santa Clara, California 95054 US
- Assignee: INTEL CORPORATION,LEE, Kevin J.,SARASWAT, Ruchir,ZILLMANN, Uwe,COWLEY, Nicholas P.,GOLDMAN, Richard J.
- Current Assignee: INTEL CORPORATION,LEE, Kevin J.,SARASWAT, Ruchir,ZILLMANN, Uwe,COWLEY, Nicholas P.,GOLDMAN, Richard J.
- Current Assignee Address: 2200 Mission College Boulevard Santa Clara, California 95054 US
- Agency: MUGHAL, Usman A.
- Main IPC: H03H7/00
- IPC: H03H7/00 ; H04B1/00
Abstract:
Described is an apparatus which comprises: a backside of a first die having a redistribution layer(RDL); one or more passive planar devices disposed on the backside, the one or more passive planar devices formed in the RDL; a front-side of the first die having an active region; and one or more vias to couple the active region with the one or more passive planar devices.
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