Invention Application
WO2016060780A9 SYSTEMS AND METHODS FOR PROVIDING DATA CHANNELS AT A DIE-TO-DIE INTERFACE
审中-公开
用于在DIE-DIE接口上提供数据通道的系统和方法
- Patent Title: SYSTEMS AND METHODS FOR PROVIDING DATA CHANNELS AT A DIE-TO-DIE INTERFACE
- Patent Title (中): 用于在DIE-DIE接口上提供数据通道的系统和方法
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Application No.: PCT/US2015050596Application Date: 2015-09-17
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Publication No.: WO2016060780A9Publication Date: 2016-12-01
- Inventor: PETERSON LUVERNE RAY , BRYAN THOMAS CLARK , LOKE ALVIN LENG SUN , WEE TIN TIN , LYNCH GREGORY FRANCIS , KNOL STEPHEN ROBERT
- Applicant: QUALCOMM INC
- Assignee: QUALCOMM INC
- Current Assignee: QUALCOMM INC
- Priority: US201414516763 2014-10-17
- Main IPC: G06F1/10
- IPC: G06F1/10 ; G06F17/50 ; G11C7/22 ; H04L7/00
Abstract:
A circuit includes a first die having a first array of exposed data nodes, and a second die having a second array of exposed data nodes, wherein a given data node of the first array corresponds to a respective data node on the second array, further wherein the first array and the second array share a spatial arrangement of the data nodes, wherein the first die has data inputs and sequential logic circuits for each of the data nodes of the first array on a first side of the first array, and wherein the second die has data outputs and sequential logic circuits for each of the data nodes of the second array on a second side of the second array, the first and second sides being different.
Information query
