Invention Application
- Patent Title: ELECTROSPUN THREE-DIMENSIONAL NANOFIBROUS SCAFFOLDS WITH INTERCONNECTED AND HIERARCHICALLY STRUCTURED PORES
- Patent Title (中): 具有互连和层状结构孔的电极三维纳米纤维
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Application No.: PCT/US2015/000507Application Date: 2015-12-23
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Publication No.: WO2016105581A1Publication Date: 2016-06-30
- Inventor: FONG, Hao , XU, Tao , ZHAO, Yong , MENKHAUS, Todd, J.
- Applicant: SOUTH DAKOTA BOARD OF REGENTS
- Applicant Address: 306 East Capitol Avenue Suite 200 Pierre, SD 57501 US
- Assignee: SOUTH DAKOTA BOARD OF REGENTS
- Current Assignee: SOUTH DAKOTA BOARD OF REGENTS
- Current Assignee Address: 306 East Capitol Avenue Suite 200 Pierre, SD 57501 US
- Agency: KENNEDY, Jonathan, L. et al.
- Priority: US62/095,994 20141223
- Main IPC: A61L27/50
- IPC: A61L27/50 ; D01D1/02 ; D04H1/728
Abstract:
The invention relates to electrospun three-dimensional (3D) nanofibrous scaffolds (with controllable porosities as high as about 96%) and methods of preparing the same. The electrospun 3D scaffolds possess interconnected and hierarchically structured pores with sizes ranging from tens of nanometers to hundreds of micrometers. In embodiments, the 3D scaffolds can be biocompatible and/or biodegradable. In some embodiments, the 3D scaffolds can be conductive. In some embodiments, the 3D scaffolds can contain bioactive species.
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