发明申请
WO2016112331A1 PACKAGED SEMICONDUCTOR DEVICE HAVING LEADFRAME FEATURES PREVENTING DELAMINATION
审中-公开
包装半导体器件具有预防分层的LEADFRAME特性
- 专利标题： PACKAGED SEMICONDUCTOR DEVICE HAVING LEADFRAME FEATURES PREVENTING DELAMINATION
- 专利标题（中）： 包装半导体器件具有预防分层的LEADFRAME特性
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申请号： PCT/US2016/012714申请日： 2016-01-08
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公开(公告)号： WO2016112331A1公开(公告)日： 2016-07-14
- 发明人: SUEANN LIM, Wei, Fen , LEE, Han Meng@Eugene Lee , BIN ABDUL AZIZ, Anis, Fauzi
- 申请人： TEXAS INSTRUMENTS INCORPORATED , TEXAS INSTRUMENTS JAPAN LIMITED
- 申请人地址： P.O. Box 655474, Mail Station 3999 Dallas, TX 75265-5474 US
- 专利权人： TEXAS INSTRUMENTS INCORPORATED,TEXAS INSTRUMENTS JAPAN LIMITED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED,TEXAS INSTRUMENTS JAPAN LIMITED
- 当前专利权人地址： P.O. Box 655474, Mail Station 3999 Dallas, TX 75265-5474 US
- 代理机构： DAVIS, Michael, A., Jr.
- 优先权： US14/592,011 20150108
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
In described examples, a semiconductor device has a leadframe with a first pad surface (401a) and a parallel second pad surface, and an assembly pad (410) bordered by two opposing sides, which include through-holes (420) from the first pad surface (401a) to the second pad surface. Another pad side includes one or more elongated windows (421) between the pad surfaces. The second pad surface includes grooves. The leadframe further has leads (430) with opposite elongated sides castellated by indents (431). Layers (440) of bondable metals are restricted to localized areas surrounding bond spots. A semiconductor chip (450) is attached to the pad (410) and wire-bonded (460) to the bond spots. A package (470) encapsulates the chip (450), wires, pad (410) and lead (430) portions, and secures the leadframe into the package (470) by filling the through-holes (420), windows (421), grooves and indents (431).
IPC分类:
