Deep reactive ion silicon etching of a device wafer, laser-induced release of individual dies, and individual placement of the dies on flexible substrates facilitate formation of circuits having relatively large external inductors for powering devices such as RFID devices. Small flexible tabs enable die-inductor connection. The absorption properties of both an adhesive layer and an ablation layer may be employed to facilitate debonding of individual dies (22') from a glass handler (28') without damaging integrated circuits (24') associated with the dies. Die packs (36) including cavities (38) for accepting individual dies facilitate fabrication processes using dies having small dimensions.