Invention Application
WO2016154315A1 METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON
审中-公开
金属粘结垫与钴网络连接层和焊接机
- Patent Title: METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON
- Patent Title (中): 金属粘结垫与钴网络连接层和焊接机
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Application No.: PCT/US2016/023785Application Date: 2016-03-23
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Publication No.: WO2016154315A1Publication Date: 2016-09-29
- Inventor: RINCK, Helmut , BAUER, Gernot , ZRILE, Robert , SCHACHTSCHNEIDER, Kai-Alexander , OTTE, Michael , WIESNER, Harald
- Applicant: TEXAS INSTRUMENTS INCORPORATED , TEXAS INSTRUMENTS DEUTSCHLAND GMBH , TEXAS INSTRUMENTS JAPAN LIMITED
- Applicant Address: P.O. Box 655474 Mail Station 3999 Dallas, TX 75265-5474 US
- Assignee: TEXAS INSTRUMENTS INCORPORATED,TEXAS INSTRUMENTS DEUTSCHLAND GMBH,TEXAS INSTRUMENTS JAPAN LIMITED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED,TEXAS INSTRUMENTS DEUTSCHLAND GMBH,TEXAS INSTRUMENTS JAPAN LIMITED
- Current Assignee Address: P.O. Box 655474 Mail Station 3999 Dallas, TX 75265-5474 US
- Agency: DAVIS, Jr., Michael A. et al.
- Priority: US14/665,799 20150323
- Main IPC: H01L21/28
- IPC: H01L21/28
Abstract:
In described examples, a method (100) of forming bond pads includes providing (101) a substrate including at least one integrated circuit (IC) device formed thereon having an oxidizable uppermost metal interconnect layer, which provides a plurality of bond pads that are coupled to circuit nodes on the IC device. The plurality of bond pads includes a metal bond pad area. A cobalt-comprising connection layer is deposited (102) directly on the metal bond pad area. The cobalt-comprising connection layer is patterned (103) to provide a cobalt bond pad surface for the plurality of bond pads, and a solder material is formed (104) on the cobalt bond pad surface.
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