Invention Application
WO2016160578A1 IMPLEMENTATION OF A ONE TIME PROGRAMMABLE MEMORY USING A MRAM STACK DESIGN
审中-公开
使用MRAM堆栈设计实现一次性可编程存储器
- Patent Title: IMPLEMENTATION OF A ONE TIME PROGRAMMABLE MEMORY USING A MRAM STACK DESIGN
- Patent Title (中): 使用MRAM堆栈设计实现一次性可编程存储器
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Application No.: PCT/US2016/024236Application Date: 2016-03-25
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Publication No.: WO2016160578A1Publication Date: 2016-10-06
- Inventor: JAN, Guenole , WANG, Po-Kang , LEE, Yuan-Jen , ZHU, Jian , LIU, Huanlong
- Applicant: HEADWAY TECHNOLOGIES, INC.
- Applicant Address: 678 South Hillview Drive Milpitas, CA 95035 US
- Assignee: HEADWAY TECHNOLOGIES, INC.
- Current Assignee: HEADWAY TECHNOLOGIES, INC.
- Current Assignee Address: 678 South Hillview Drive Milpitas, CA 95035 US
- Agency: ACKERMAN, Stephen, B.
- Priority: US62/142,591 20150403; US15/078,182 20160323
- Main IPC: G11C17/16
- IPC: G11C17/16
Abstract:
An integrated circuit includes a magnetic OTP memory array formed of multiple magnetic OTP memory cells having an MTJ stack with a fixed magnetic layer, a tunnel barrier insulating layer, a free magnetic layer, and a second electrode. When a voltage is applied across the magnetic OTP memory cell, the resistance of the MTJ stack and the gating transistor form a voltage divider to apply a large voltage across the MTJ stack to breakdown the tunnel barrier to short the fixed layer to the free layer. The integrated circuit has multiple MRAM arrays configured such that each of the multiple MRAM arrays have performance and density criteria that match MOS transistor based memory including SRAM, DRAM, and flash memory. The integrated circuit may include a functional logic unit connected with the magnetic OTP memory arrays and the MRAM arrays for providing digital data storage.
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