Invention Application
- Patent Title: MULTILAYER COUPLING INTERFACE
- Patent Title (中): 多层耦合接口
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Application No.: PCT/CN2016/083311Application Date: 2016-05-25
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Publication No.: WO2016192554A1Publication Date: 2016-12-08
- Inventor: ZHANG, Chunshu , CELO, Dritan , BERNIER, Eric
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: Huawei Administration Building Bantian, Longgang District Shenzhen, Guangdong 518129 CN
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: Huawei Administration Building Bantian, Longgang District Shenzhen, Guangdong 518129 CN
- Priority: US62/168,273 20150529; US14/886,285 20151019
- Main IPC: G02B6/42
- IPC: G02B6/42
Abstract:
An optical coupling input/output interface including a multilayer ribbon comprising a plurality of layers with each layer having a plurality of waveguides. The I/O interface further includes a coupling interface section, wherein the plurality of layers are staggered to allow for evanescent coupling of the waveguides of each layer with a corresponding layer of waveguides in a photonic device.
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