Invention Application
- Patent Title: BUILD TEMPERATURE MODULATION
- Patent Title (中): 建立温度调节
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Application No.: PCT/US2015/035168Application Date: 2015-06-10
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Publication No.: WO2016200384A1Publication Date: 2016-12-15
- Inventor: NOVICK, Michael A.
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: 11445 Compaq Center Drive W. Houston, Texas 77070 US
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: 11445 Compaq Center Drive W. Houston, Texas 77070 US
- Agency: LEMMON, Marcus B. et al.
- Main IPC: B29C67/00
- IPC: B29C67/00 ; B33Y50/02
Abstract:
According to an example, build temperature modulation may include determining a characteristic of an object to be produced by three-dimensional printing. The three-dimensional printing may divide the object into a plurality of printing areas for producing the object by using a fusing agent. The build temperature modulation may further include determining, based on the characteristic of the object to be produced by the three-dimensional printing, a fusing agent flux amount of the fusing agent sufficient to oversaturate a printing area of the plurality of printing areas to modulate temperatures related to the plurality of printing areas to a substantially constant temperature across the plurality of printing areas.
Information query