Invention Application
- Patent Title: SEMICONDUCTOR PROCESSING METHOD
- Patent Title (中): 半导体处理方法
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Application No.: PCT/SG2016/050385Application Date: 2016-08-12
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Publication No.: WO2017030501A1Publication Date: 2017-02-23
- Inventor: CHEW, Yi Xin
- Applicant: PEP INNOVATION PTE LTD
- Applicant Address: 65 A Jalan Tenteram, #05-04, Singapore 328958 SG
- Assignee: PEP INNOVATION PTE LTD
- Current Assignee: PEP INNOVATION PTE LTD
- Current Assignee Address: 65 A Jalan Tenteram, #05-04, Singapore 328958 SG
- Agency: ONG, Jean Li, Magdelene
- Priority: SG10201506419V 20150814; SG10201509217Q 20151106
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L23/544 ; H01L21/98 ; H01L23/28 ; H01L23/32
Abstract:
A semiconductor processing method is provided. The method includes providing a first carrier (10). A first adhesive (18) is provided on the first carrier (10) and a plurality of semiconductor chips (20) is placed on the first adhesive (18). A second carrier (28) is provided. The second carrier (28) is provided with a plurality of chip receiving areas (32). The first and second carriers (10) and (28) are then brought together to attach the semiconductor chips (20) to respective ones of the chip receiving areas (32) on the second carrier (28). The first carrier (10) is then separated from the semiconductor chips (20).
Information query
IPC分类:
