Invention Application
- Patent Title: THERMAL SENSOR PLACEMENT FOR HOTSPOT INTERPOLATION
- Patent Title (中): 热传感器放置用于HOTSPOT插值
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Application No.: PCT/US2016/049300Application Date: 2016-08-29
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Publication No.: WO2017044341A1Publication Date: 2017-03-16
- Inventor: COUTTS, Ryan Michael , MITTAL, Rajat , SAEIDI, Mehdi , PENZES, Paul Ivan
- Applicant: QUALCOMM INCORPORATED
- Applicant Address: ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714 US
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714 US
- Agency: WORLEY, Eugene
- Priority: US14/852,350 20150911
- Main IPC: G06F11/30
- IPC: G06F11/30
Abstract:
In one embodiment, a temperature management system comprises a plurality of thermal sensors at different locations on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the thermal sensors, to fit a quadratic temperature model to the received temperature readings, and to estimate a hotspot temperature on the chip using the fitted quadratic temperature model.
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