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    DYNAMIC AND FAST LOCAL HOTSPOT SEARCH AND REAL TIME TEMPERATURE MONITORING
    1.
    发明申请
    DYNAMIC AND FAST LOCAL HOTSPOT SEARCH AND REAL TIME TEMPERATURE MONITORING 审中-公开
    动态快速局部热靴搜索和实时温度监测

    公开(公告)号：WO2018049309A1

    公开(公告)日：2018-03-15

    申请号：PCT/US2017/050920

    申请日：2017-09-11

    Applicant: QUALCOMM INCORPORATED

    Inventor： KESKIN, Mustafa ,  ROHAM, Masoud ,  SAEIDI, Mehdi ,  DERBYSHIRE, Amy ,  GILMORE, Robert ,  CHUA-EOAN, Lew

    IPC: G06F1/20

    CPC classification number: G01K1/026 ,  G01K1/14 ,  G05D23/1917 ,  G06F1/206 ,  G06F12/1009 ,  G06F2212/1016 ,  Y02D10/16

    Abstract: In certain aspects, a method for temperature monitoring comprises receiving temperature readings from a plurality of temperature sensors on a chip, and determining an average or a sum of the temperature readings from the temperature sensors. The sum may be a weighted sum of the temperature readings. The method also comprises computing a temperature at a location on the chip based on the average or sum of the temperature readings. The location may be located at approximately a centroid of the locations of the temperature sensors, an estimated hotspot location on the chip, or another location on the chip.

    Abstract translation: 在某些方面，用于温度监测的方法包括接收来自芯片上的多个温度传感器的温度读数，并且确定来自温度传感器的温度读数的平均值或总和。 总和可以是温度读数的加权和。 该方法还包括基于温度读数的平均值或总和来计算芯片上的位置处的温度。 位置可以位于温度传感器的位置，芯片上估计的热点位置或芯片上的另一位置的大致中心处。

    THERMAL MANAGEMENT OF ELECTRONIC HEADSETS
    2.
    发明申请
    THERMAL MANAGEMENT OF ELECTRONIC HEADSETS 审中-公开
    电子耳机的热管理

    公开(公告)号：WO2017039977A1

    公开(公告)日：2017-03-09

    申请号：PCT/US2016/046130

    申请日：2016-08-09

    Applicant: QUALCOMM INCORPORATED

    Inventor： RAHIM, Emil ,  SAEIDI, Mehdi ,  MITTAL, Arpit ,  MITTAL, Rajat

    IPC: G06F3/01 ,  G06F1/20 ,  G06F1/16

    CPC classification number: G06F1/163 ,  G02B27/0176 ,  G06F1/203 ,  G06F3/011 ,  H05K7/20127 ,  H05K7/20509

    Abstract: Systems and methods relate to thermal management of electronic headsets, such as virtual reality headsets. An electronic headset includes a body which can hold a processing system. A heat spreader is attached to the body, wherein the heat spreader includes a chimney. The chimney is designed to dissipate heat generated by the processing system. The heat spreader can be controlled to extend the chimney based on the heat perceived on external surfaces of the electronic headset which can come in contact with a user's skin. The chimney includes an air gap and provides a passive cooling system.

    Abstract translation: 系统和方法涉及电子耳机的热管理，例如虚拟现实耳机。 电子耳机包括可容纳处理系统的主体。 散热器附接到身体，其中散热器包括烟囱。 烟囱旨在消散处理系统产生的热量。 可以根据能够与用户皮肤接触的电子耳机的外表面感知到的热量来控制散热器来扩展烟囱。 烟囱包括气隙，并提供被动冷却系统。

    TECHNIQUES FOR IMPLEMENTING A SYNTHETIC JET TO COOL A DEVICE
    3.
    发明申请
    TECHNIQUES FOR IMPLEMENTING A SYNTHETIC JET TO COOL A DEVICE 审中-公开
    用于实施合成喷嘴以冷却装置的技术

    公开(公告)号：WO2016200521A1

    公开(公告)日：2016-12-15

    申请号：PCT/US2016/031143

    申请日：2016-05-06

    Applicant: QUALCOMM INCORPORATED

    Inventor： SAEIDI, Mehdi ,  MITTAL, Arpit ,  RAHIM, Emil ,  MITTAL, Rajat ,  SAMADI, Kambiz

    IPC: H05K7/20 ,  H05K1/02

    CPC classification number: H05K1/0203 ,  G05B15/02 ,  H05K1/0209 ,  H05K1/0272 ,  H05K7/20145 ,  H05K7/20172 ,  H05K7/20209 ,  H05K2201/064

    Abstract: Methods and apparatus for implementing a synthetic jet to cool a device are provided. Examples of the techniques keep a device case cool enough to be hand-held, while allowing a higher temperature of a circuit component located in the case, to maximize circuit performance. In an example, provided is a mobile device including a synthetic jet configured to transfer heat within the mobile device. The synthetic jet can be embedded in a circuit board inside the mobile device such that the circuit board defines at least a portion of a chamber of the synthetic jet and defines an orifice of the synthetic jet. The device case can define at least one fluid channel inside the mobile device. Also, the circuit board can define a synthetic jet outlet configured to direct a fluid at the at least one fluid channel. Also provided are methods for controlling a synthetic jet.

    Abstract translation: 提供了用于实施合成射流以冷却装置的方法和装置。 这些技术的示例使得器件的壳体足够冷却成为手持式，同时允许位于壳体中的电路元件的较高温度以最大化电路性能。 在一个示例中，提供了包括被配置为在移动设备内传递热量的合成射流的移动设备。 合成射流可以嵌入在移动装置内的电路板中，使得电路板限定合成射流的室的至少一部分并且限定合成射流的孔口。 设备壳体可以在移动设备内定义至少一个流体通道。 此外，电路板可以限定配置成在至少一个流体通道处引导流体的合成射流出口。 还提供了用于控制合成射流的方法。

    ALGORITHM FOR PREFERRED CORE SEQUENCING TO MAXIMIZE PERFORMANCE AND REDUCE CHIP TEMPERATURE AND POWER
    4.
    发明申请
    ALGORITHM FOR PREFERRED CORE SEQUENCING TO MAXIMIZE PERFORMANCE AND REDUCE CHIP TEMPERATURE AND POWER 审中-公开
    用于优化核心序列的算法以最大限度地提高性能并降低芯片温度和功率

    公开(公告)号：WO2015179147A1

    公开(公告)日：2015-11-26

    申请号：PCT/US2015/029983

    申请日：2015-05-08

    Applicant: QUALCOMM INCORPORATED

    Inventor： MITTAL, Rajat ,  SAEIDI, Mehdi ,  XUE, Tao ,  ALTON, Ronald Frank ,  CHANDRA, Rajit ,  DASNURKAR, Sachin

    IPC: G06F1/32 ,  G06F9/48 ,  G06F9/50

    CPC classification number: G06F1/3234 ,  G06F1/28 ,  G06F1/3203 ,  G06F1/3206 ,  G06F1/329 ,  G06F1/3293 ,  G06F9/5094 ,  Y02D10/122 ,  Y02D10/22 ,  Y02D10/24

    Abstract: Aspects include computing devices, systems, and methods for selecting preferred processor core combinations for a state of a computing device. In an aspect, a state of a computing device containing the multi-core processor may be determined. A number of current leakage ratios may be determined by comparing current leakages of the processor cores to current leakages of the other processor cores. The ratios may be compared to boundaries for the state of the computing device in respective inequalities. A processor core associated with a number of boundaries may be selected in response to determining that the respective inequalities are true. The boundaries may be associated with a set of processor cores deemed preferred for an associated state of the computing device. The processor core present in the set of processor cores for each boundary of a true inequality may be the selected processor core.

    Abstract translation: 方面包括用于为计算设备的状态选择优选处理器核心组合的计算设备，系统和方法。 在一方面，可以确定包含多核处理器的计算设备的状态。 可以通过将处理器核心的当前泄漏与其他处理器核心的当前泄漏进行比较来确定多个电流泄漏比。 可以将这些比率与各个不等式中的计算装置的状态的边界进行比较。 响应于确定相应的不等式是真实的，可以选择与多个边界相关联的处理器核心。 边界可以与被认为对于计算设备的相关状态优选的一组处理器核心相关联。 存在于真正不等式的每个边界的处理器核心集合中的处理器核心可以是所选择的处理器核心。

    CIRCUITS AND METHODS PROVIDING TEMPERATURE MITIGATION FOR COMPUTING DEVICES USING ESTIMATED SKIN TEMPERATURE
    6.
    发明申请
    CIRCUITS AND METHODS PROVIDING TEMPERATURE MITIGATION FOR COMPUTING DEVICES USING ESTIMATED SKIN TEMPERATURE 审中-公开
    使用估计的皮肤温度为计算设备提供温度降低的电路和方法

    公开(公告)号：WO2017053067A1

    公开(公告)日：2017-03-30

    申请号：PCT/US2016/050576

    申请日：2016-09-07

    Applicant: QUALCOMM INCORPORATED

    Inventor： MITTAL, Arpit ,  SAEIDI, Mehdi ,  MAHMOUDI, Farsheed

    IPC: G06F1/32

    CPC classification number: G06F1/206 ,  G05B15/02 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/172

    Abstract: A method for temperature mitigation includes receiving a signal from a temperature sensor that is disposed within a computing device. A processor chip within the computing device produces heat. The signal from the temperature sensor is converted to temperature data. The method further includes processing the temperature data to generate an estimate of a temperature of an external surface of the device. The processing includes applying a low pass filter to the temperature data, applying an amplitude attenuation to the temperature data, and applying a delay to the temperature data. The method further includes reducing an operating parameter of the processor chip, such as operating frequency, in response to the estimated temperature of the external surface of the device.

    Abstract translation: 一种用于温度缓解的方法包括从设置在计算设备内的温度传感器接收信号。 计算设备内的处理器芯片产生热量。 温度传感器的信号转换为温度数据。 该方法还包括处理温度数据以产生装置的外表面温度的估计。 该处理包括对温度数据应用低通滤波器，对温度数据施加幅度衰减，以及对温度数据应用延迟。 该方法还包括响应于设备的外表面的估计温度来减小处理器芯片的操作参数，例如工作频率。

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