Invention Application
WO2017044736A1 PROCESS FOR PROTECTING AN ELECTRONIC DEVICE BY SELECTIVE DEPOSITION OF POLYMER COATINGS
审中-公开
通过选择性沉积聚合物涂层来保护电子器件的工艺
- Patent Title: PROCESS FOR PROTECTING AN ELECTRONIC DEVICE BY SELECTIVE DEPOSITION OF POLYMER COATINGS
- Patent Title (中): 通过选择性沉积聚合物涂层来保护电子器件的工艺
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Application No.: PCT/US2016/050935Application Date: 2016-09-09
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Publication No.: WO2017044736A1Publication Date: 2017-03-16
- Inventor: AHMAD, Syed, Taymur , ACTON, Bruce
- Applicant: AHMAD, Syed, Taymur , ACTON, Bruce
- Applicant Address: 860 W Blackhawk Chicago, IL 60642 US
- Assignee: AHMAD, Syed, Taymur,ACTON, Bruce
- Current Assignee: AHMAD, Syed, Taymur,ACTON, Bruce
- Current Assignee Address: 860 W Blackhawk Chicago, IL 60642 US
- Agency: CHAPMAN, Ernest, F. et al.
- Priority: US62/217,416 20150911
- Main IPC: H05K3/28
- IPC: H05K3/28
Abstract:
Methods for protecting an electronic device from contaminants by applying different polymeric materials to different vital components of a device are disclosed. In one embodiment, the method comprises applying (110,120) a first polymer, such as (210,220) an acrylic-based polymer, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying (140) a second polymer, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with a different polymers, without the need for multilayer coatings on any component. Electronic devices that are protected by such polymeric, hydrophobic coatings are also disclosed. Non-limiting examples of such devices include smart phones, computers, and gaming devices.
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