公开(公告)号：WO2017044736A1

公开(公告)日：2017-03-16

申请号：PCT/US2016/050935

申请日：2016-09-09

Applicant: AHMAD, Syed, Taymur ,  ACTON, Bruce

Inventor： AHMAD, Syed, Taymur ,  ACTON, Bruce

IPC: H05K3/28

CPC classification number: C09D183/04 ,  C09D133/16 ,  H01R12/716 ,  H05K1/0353 ,  H05K3/282 ,  H05K3/284 ,  H05K3/285 ,  H05K3/40 ,  H05K7/1427 ,  H05K2201/0162 ,  H05K2201/0187 ,  H05K2203/1173 ,  H05K2203/121 ,  H05K2203/1322 ,  H05K2203/1338 ,  H05K2203/1361 ,  H05K2203/1366 ,  H05K2203/1572

Abstract: Methods for protecting an electronic device from contaminants by applying different polymeric materials to different vital components of a device are disclosed. In one embodiment, the method comprises applying (110,120) a first polymer, such as (210,220) an acrylic-based polymer, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying (140) a second polymer, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with a different polymers, without the need for multilayer coatings on any component. Electronic devices that are protected by such polymeric, hydrophobic coatings are also disclosed. Non-limiting examples of such devices include smart phones, computers, and gaming devices.

Abstract translation: 公开了通过将不同的聚合物材料施加到装置的不同重要部件来保护电子装置免受污染物的方法。 在一个实施例中，该方法包括将（110,120）第一聚合物（例如（210,220）基于丙烯酸的聚合物）施加到位于所述装置的印刷电路板上的一个或多个连接器和部件。 该方法还包括将第二聚合物（例如硅氧烷基聚合物）施加（140）到印刷电路板上的不同连接器和部件。 该方法导致不同的组分被不同的聚合物涂覆，而不需要任何组分上的多层涂层。 还公开了由这种聚合物疏水涂层保护的电子器件。 这种设备的非限制性示例包括智能电话，计算机和游戏设备。

公开(公告)号：WO2016196953A8

公开(公告)日：2016-12-08

申请号：PCT/US2016/035746

申请日：2016-06-03

Applicant: KIM, Thomas ,  AHMAD, Syed, Taymur ,  ACTON, Bruce

Inventor： KIM, Thomas ,  AHMAD, Syed, Taymur ,  ACTON, Bruce

IPC: C09D5/16

Abstract: Methods for protecting an electronic device from contaminants by applying multiple polymeric layers on the vital components of a device are disclosed. In one embodiment, the method comprises applying a multilayered, hydrophobic coating that is inert to electrical conductivity on one or more components of the device. The method includes applying to a component of a device a first layer comprising a first polymer, such as a silicone-based polymer, and a second layer comprising a second polymer, such as an acrylic-based polymer on top of the first layer. Each of the first and second layers exhibits a water contact angle greater than 90°, such as at least 110°. Electronic devices that are protected by such multilayered, hydrophobic coatings are also disclosed. Non-limiting examples of such devices include smart phones, computers, and gaming devices.

Abstract translation: 公开了通过在器件的关键组件上应用多个聚合物层来保护电子器件免受污染物的方法。 在一个实施方案中，该方法包括对该装置的一个或多个部件施加对电导率呈惰性的多层疏水涂层。 该方法包括在第一层的顶部上将包含第一聚合物（例如硅氧烷基聚合物）的第一层和包含第二聚合物（例如基于丙烯酸的聚合物）的第二层施加到装置的部件。 第一层和第二层各自表现出大于90°，​​例如至少110°的水接触角。 也公开了由这种多层疏水涂层保护的电子器件。 这种设备的非限制性例子包括智能电话，计算机和游戏设备。

公开(公告)号：WO2018111306A1

公开(公告)日：2018-06-21

申请号：PCT/US2016/067257

申请日：2016-12-16

Applicant: AHMAD, Syed Taymur ,  ACTON, Bruce

Inventor： AHMAD, Syed Taymur ,  ACTON, Bruce

IPC: H05K3/28 ,  H05K1/02

CPC classification number: H05K3/284 ,  H05K1/0218 ,  H05K1/0259 ,  H05K3/285 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2201/10037 ,  H05K2201/10083 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2203/1476 ,  H05K2203/1572

Abstract: Methods for protecting an electronic device from contaminants by applying different insulating and conducting materials to different vital components of a device are disclosed. In one embodiment, the method comprises applying an electrically insulating material, such as isobutylene isoprene rubber, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying a polymer capable of carrying a charge, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with different materials. Electronic devices that are protected by such coatings are also disclosed, such as smart phones, computers, head phones, and gaming devices, all of which show improve protection from contaminants, especially liquid contaminants.

公开(公告)号：WO2017049185A1

公开(公告)日：2017-03-23

申请号：PCT/US2016/052284

申请日：2016-09-16

Applicant: AHMAD, Syed, Taymur ,  ACTON, Bruce

Inventor： AHMAD, Syed, Taymur ,  ACTON, Bruce

IPC: H05K3/28 ,  B05D5/12

CPC classification number: H04B1/3888 ,  G06F1/1616 ,  G06F1/1626 ,  H05K3/28 ,  H05K3/284 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2203/1361 ,  H05K2203/1366

Abstract: Methods for protecting an electronic device from contaminants by applying different polymeric materials to different vital components of a device are disclosed, in one embodiment, the method comprises applying an electrically insulating polymer, such as an acrylic-based polymer, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying a polymer capable of carrying a charge, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with a different polymers. Electronic devices that are protected by such polymeric, hydrophobic coatings are also disclosed, such as smart phones, computers, and gaming devices.

Abstract translation: 在一个实施方案中，公开了通过将不同的聚合物材料施加到装置的不同重要组分来保护电子装置免受污染物的方法，所述方法包括将诸如丙烯酸类聚合物的电绝缘聚合物施加到一个或多个连接器上，以及 位于设备印刷电路板上的部件。 该方法还包括将能够携带电荷的聚合物（例如硅氧烷基聚合物）施加到印刷电路板上的不同连接器和部件上。 该方法导致不同的组分被不同的聚合物涂覆。 还公开了由这种聚合物，疏水涂层保护的电子器件，例如智能电话，计算机和游戏设备。

公开(公告)号：WO2016196953A1

公开(公告)日：2016-12-08

申请号：PCT/US2016/035746

申请日：2016-06-03

Applicant: KIM, Thomas ,  AHMAD, Syed, Taymur ,  ACTON, Bruce

Inventor： KIM, Thomas ,  AHMAD, Syed, Taymur ,  ACTON, Bruce

IPC: C09D5/16

CPC classification number: C09D5/08 ,  C09D5/1693 ,  C09D133/16 ,  C09D183/04

Abstract: Methods for protecting an electronic device from contaminants by applying multiple polymeric layers on the vital components of a device are disclosed. In one embodiment, the method comprises applying a multilayered, hydrophobic coating that is inert to electrical conductivity on one or more components of the device. The method includes applying to a component of a device a first layer comprising a first polymer, such as a silicone-based polymer, and a second layer comprising a second polymer, such as an acrylic-based polymer on top of the first layer. Each of the first and second layers exhibits a water contact angle greater than 90°, such as at least 110°. Electronic devices that are protected by such multilayered, hydrophobic coatings are also disclosed. Non-limiting examples of such devices include smart phones, computers, and gaming devices.

Abstract translation: 公开了通过在装置的重要部件上施加多个聚合物层来保护电子装置免受污染物的方法。 在一个实施方案中，该方法包括对器件的一个或多个组件施加对电导率为惰性的多层疏水涂层。 该方法包括将包含第一聚合物（例如硅氧烷基聚合物）的第一层和包含第二聚合物（例如基于丙烯酸的聚合物）的第二层施加至器件的部件，第二层在第一层的顶部上。 第一层和第二层中的每一层表现出大于90°的水接触角，例如至少110°。 还公开了由这种多层疏水涂层保护的电子器件。 这种设备的非限制性示例包括智能电话，计算机和游戏设备。