Invention Application
WO2017053067A1 CIRCUITS AND METHODS PROVIDING TEMPERATURE MITIGATION FOR COMPUTING DEVICES USING ESTIMATED SKIN TEMPERATURE
审中-公开
使用估计的皮肤温度为计算设备提供温度降低的电路和方法
- Patent Title: CIRCUITS AND METHODS PROVIDING TEMPERATURE MITIGATION FOR COMPUTING DEVICES USING ESTIMATED SKIN TEMPERATURE
- Patent Title (中): 使用估计的皮肤温度为计算设备提供温度降低的电路和方法
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Application No.: PCT/US2016/050576Application Date: 2016-09-07
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Publication No.: WO2017053067A1Publication Date: 2017-03-30
- Inventor: MITTAL, Arpit , SAEIDI, Mehdi , MAHMOUDI, Farsheed
- Applicant: QUALCOMM INCORPORATED
- Applicant Address: ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714 US
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714 US
- Agency: KELTON, Thomas W. et al.
- Priority: US14/860,203 20150921
- Main IPC: G06F1/32
- IPC: G06F1/32
Abstract:
A method for temperature mitigation includes receiving a signal from a temperature sensor that is disposed within a computing device. A processor chip within the computing device produces heat. The signal from the temperature sensor is converted to temperature data. The method further includes processing the temperature data to generate an estimate of a temperature of an external surface of the device. The processing includes applying a low pass filter to the temperature data, applying an amplitude attenuation to the temperature data, and applying a delay to the temperature data. The method further includes reducing an operating parameter of the processor chip, such as operating frequency, in response to the estimated temperature of the external surface of the device.
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