Invention Application
- Patent Title: SWAGING PROCESS FOR COMPLEX INTEGRATED HEAT SPREADERS
- Patent Title (中): 复合集成散热器的分解过程
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Application No.: PCT/US2015/000397Application Date: 2015-12-26
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Publication No.: WO2017111839A1Publication Date: 2017-06-29
- Inventor: TANG, Zhizhong , KOURAKATA, Shinobu , OGATA, Kazuo , START, Paul, R. , JIAN, Syadwad , LABANOK, William, Nicholas , HU, Wei , LI, Peng , YOUNG, Douglas, R. , CONSTABLE, Gregory, S. , BEATTY, John, J. , BHATTI, Pardeep, K. , GARNER, Luke, J. , ANTONISWAMY, Aravindha, R.
- Applicant: INTEL CORPORATION , TANG, Zhizhong , KOURAKATA, Shinobu , OGATA, Kazuo , START, Paul, R. , JIAN, Syadwad , LABANOK, William, Nicholas , HU, Wei , LI, Peng , YOUNG, Douglas, R. , CONSTABLE, Gregory, S. , BEATTY, John, J. , BHATTI, Pardeep, K. , GARNER, Luke, J. , ANTONISWAMY, Aravindha, R.
- Applicant Address: 2200 Mission College Boulevard Santa Clara, CA 95054 US
- Assignee: INTEL CORPORATION,TANG, Zhizhong,KOURAKATA, Shinobu,OGATA, Kazuo,START, Paul, R.,JIAN, Syadwad,LABANOK, William, Nicholas,HU, Wei,LI, Peng,YOUNG, Douglas, R.,CONSTABLE, Gregory, S.,BEATTY, John, J.,BHATTI, Pardeep, K.,GARNER, Luke, J.,ANTONISWAMY, Aravindha, R.
- Current Assignee: INTEL CORPORATION,TANG, Zhizhong,KOURAKATA, Shinobu,OGATA, Kazuo,START, Paul, R.,JIAN, Syadwad,LABANOK, William, Nicholas,HU, Wei,LI, Peng,YOUNG, Douglas, R.,CONSTABLE, Gregory, S.,BEATTY, John, J.,BHATTI, Pardeep, K.,GARNER, Luke, J.,ANTONISWAMY, Aravindha, R.
- Current Assignee Address: 2200 Mission College Boulevard Santa Clara, CA 95054 US
- Agency: VAN NESS, Mark, C. et al.
- Main IPC: H01L23/36
- IPC: H01L23/36
Abstract:
Embodiments are generally directed to a swaging process for complex integrated heat spreaders. An embodiment of an integrated heat spreader includes components, each of the components including one or more swage points; and a multiple swage joints, each swage joint including a swage pin joining two or more components, wherein components are joined into a single integrated heat spreader unit by the swage joints.
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