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公开(公告)号:WO2017086911A1
公开(公告)日:2017-05-26
申请号:PCT/US2015/060831
申请日:2015-11-16
Applicant: INTEL CORPORATION , HU, Wei , ANTONISWAMY, Aravindha R. , FITZGERALD, Thomas J. , PATEL, Nikunj P. , JAIN, Syadwad , TANG, Zhizhong , KOTHARI, Shrenik
Inventor: HU, Wei , ANTONISWAMY, Aravindha R. , FITZGERALD, Thomas J. , PATEL, Nikunj P. , JAIN, Syadwad , TANG, Zhizhong , KOTHARI, Shrenik
CPC classification number: H01L21/4871 , H01L23/367 , H01L23/3675 , H01L23/3731 , H01L23/3736 , H01L23/42 , H01L23/544 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486
Abstract: Disclosed herein are embodiments of sintered heat spreaders with inserts and related devices and methods. In some embodiments, a heat spreader may include: a frame including aluminum and a polymer binder; an insert disposed in the frame, wherein the insert has a thermal conductivity higher than a thermal conductivity of the frame; and a recess having at least one sidewall formed by the frame. The polymer binder may be left over from sintering frame material and insert material to form the heat spreader.
Abstract translation: 这里公开了具有插入件和相关装置和方法的烧结散热器的实施例。 在一些实施例中,散热器可以包括:包括铝和聚合物粘合剂的框架; 设置在所述框架中的插入件,其中所述插入件具有比所述框架的导热率更高的导热率; 以及具有由框架形成的至少一个侧壁的凹部。 聚合物粘合剂可以从烧结框架材料上留下并插入材料以形成散热器。 p>
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公开(公告)号:WO2017111839A1
公开(公告)日:2017-06-29
申请号:PCT/US2015/000397
申请日:2015-12-26
Applicant: INTEL CORPORATION , TANG, Zhizhong , KOURAKATA, Shinobu , OGATA, Kazuo , START, Paul, R. , JIAN, Syadwad , LABANOK, William, Nicholas , HU, Wei , LI, Peng , YOUNG, Douglas, R. , CONSTABLE, Gregory, S. , BEATTY, John, J. , BHATTI, Pardeep, K. , GARNER, Luke, J. , ANTONISWAMY, Aravindha, R.
Inventor: TANG, Zhizhong , KOURAKATA, Shinobu , OGATA, Kazuo , START, Paul, R. , JIAN, Syadwad , LABANOK, William, Nicholas , HU, Wei , LI, Peng , YOUNG, Douglas, R. , CONSTABLE, Gregory, S. , BEATTY, John, J. , BHATTI, Pardeep, K. , GARNER, Luke, J. , ANTONISWAMY, Aravindha, R.
IPC: H01L23/36
CPC classification number: H01L21/4882 , H01L23/3675 , H01L23/49833 , H01L2224/16225 , H01L2224/73253 , H01L2924/15311
Abstract: Embodiments are generally directed to a swaging process for complex integrated heat spreaders. An embodiment of an integrated heat spreader includes components, each of the components including one or more swage points; and a multiple swage joints, each swage joint including a swage pin joining two or more components, wherein components are joined into a single integrated heat spreader unit by the swage joints.
Abstract translation: 实施例通常针对用于复杂集成散热器的模锻过程。 集成散热器的实施例包括部件,每个部件包括一个或多个型锻点; 和多个型锻接头,每个型锻接头包括连接两个或多个部件的型锻销,其中部件通过型锻接头连接到单个整体式散热器单元中。 p>
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公开(公告)号:WO2017086912A1
公开(公告)日:2017-05-26
申请号:PCT/US2015/060832
申请日:2015-11-16
Applicant: INTEL CORPORATION , ANTONISWAMY, Aravindha R. , JAIN, Syadwad , TANG, Zhizhong , HU, Wei
Inventor: ANTONISWAMY, Aravindha R. , JAIN, Syadwad , TANG, Zhizhong , HU, Wei
IPC: H01L23/34
CPC classification number: H01L23/3675 , H01L21/4871 , H01L23/36
Abstract: Disclosed herein are embodiments of heat spreaders with interlocked inserts, and related devices and methods. In some embodiments, a heat spreader may include: a frame formed of a first material, wherein the frame includes an opening, a projection of the frame extends into the opening, and the projection has a top surface, a side surface, and a bottom surface; a recess having at least one sidewall formed by the frame; and an insert formed of a second material different from the first material, wherein the insert is disposed in the frame and in contact with the top surface, the side surface, and the bottom surface of the projection.
Abstract translation: 这里公开了具有互锁插入件的散热器以及相关装置和方法的实施例。 在一些实施例中,散热器可以包括:由第一材料形成的框架,其中框架包括开口,框架的突出部延伸到开口中,并且突出部具有顶表面,侧表面和底部 表面; 具有由所述框架形成的至少一个侧壁的凹部; 以及由与第一材料不同的第二材料形成的插入件,其中插入件设置在框架中并与突出部的顶表面,侧表面和底表面接触。 p>
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