发明申请
WO2017115461A1 BONDED SUBSTRATE AND METHOD FOR MANUFACTURING BONDED SUBSTRATE
审中-公开
粘合基板和用于制造粘合基板的方法
- 专利标题： BONDED SUBSTRATE AND METHOD FOR MANUFACTURING BONDED SUBSTRATE
- 专利标题（中）： 粘合基板和用于制造粘合基板的方法
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申请号： PCT/JP2016/005212申请日： 2016-12-22
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公开(公告)号： WO2017115461A1公开(公告)日： 2017-07-06
- 发明人: TANI, Makoto , AWAKURA, Yasutaka , KAKU, Takeshi , EBIGASE, Takashi
- 申请人： NGK INSULATORS, LTD.
- 申请人地址： 2-56, Suda-cho, Mizuho-ku, Nagoya-shi, Aichi 4678530 JP
- 专利权人： NGK INSULATORS, LTD.
- 当前专利权人： NGK INSULATORS, LTD.
- 当前专利权人地址： 2-56, Suda-cho, Mizuho-ku, Nagoya-shi, Aichi 4678530 JP
- 代理机构： YOSHITAKE, Hidetoshi et al.
- 优先权： JPPCT/JP2015/086477 20151228
- 主分类号： H01L23/15
- IPC分类号： H01L23/15 ; H01L21/48
摘要：
Provided is a bonded substrate mainly for mounting a power semiconductor in which the reliability to a thermal cycle has been enhanced as compared with a conventional one. In a bonded substrate in which a copper plate is bonded to one or both main surface(s) of a nitride ceramic substrate, a bonding layer consisting of TiN intervenes between the nitride ceramic substrate and the copper plate and is adjacent at least to the copper plate, and an Ag distribution region in which Ag atoms are distributed is set to be present in the copper plate. Preferably, an Ag-rich phase is set to be present discretely at an interface between the bonding layer and the copper plate.
IPC分类:
