Invention Application
WO2017172028A1 SYSTEMS, METHODS AND DEVICES FOR USING THERMAL MARGIN OF A CORE IN A PROCESSOR
审中-公开
用于在处理器中使用核心的热边缘的系统，方法和设备
- Patent Title: SYSTEMS, METHODS AND DEVICES FOR USING THERMAL MARGIN OF A CORE IN A PROCESSOR
- Patent Title (中): 用于在处理器中使用核心的热边缘的系统，方法和设备
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Application No.: PCT/US2017/015868Application Date: 2017-01-31
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Publication No.: WO2017172028A1Publication Date: 2017-10-05
- Inventor: CARTAGENA, Daniel G. , GOUGH, Corey D. , GARG, Vivek , GUPTA, Nikhil
- Applicant: INTEL CORPORATION
- Applicant Address: 2200 Mission College Boulevard Santa Clara, California 95054 US
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: 2200 Mission College Boulevard Santa Clara, California 95054 US
- Agency: BARKER, Aaron D.
- Priority: US15/086,456 20160331
- Main IPC: G06F1/20
- IPC: G06F1/20 ; G06F1/32 ; G06F9/48
Abstract:
A dynamic adjustment of core power can reduce thermal margin between thermal design power (TDP) and an allowable thermal load. For example, by focusing directly on the core temperatures explicitly, a per-core closed loop temperature controller (pCLTC) can remove conservatism induced by the power level 1 policy (PL1, a policy which defines frequency and/or power for the processor under sustained load) thereby allowing for increased processor performance when there exists margin in the thermal system.
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