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Invention Application
WO2017207564A1 METHOD FOR CLEAVING AMIDE BONDS 审中-公开
清除酰胺键的方法

  • Patent Title: METHOD FOR CLEAVING AMIDE BONDS
  • Patent Title (中): 清除酰胺键的方法
  • Application No.: PCT/EP2017/063029
    Application Date: 2017-05-30
  • Publication No.: WO2017207564A1
    Publication Date: 2017-12-07
  • Inventor: OLSSON, Johan , HARRIS, Craig, Steven
  • Applicant: GALDERMA S.A.
  • Applicant Address: Zugerstrasse 8 6330 Cham CH
  • Assignee: GALDERMA S.A.
  • Current Assignee: GALDERMA S.A.
  • Current Assignee Address: Zugerstrasse 8 6330 Cham CH
  • Agency: AWAPATENT AB
  • Priority: EP16172225.1 20160531; EP16172241.8 20160531; EP16172254.1 20160531; EPPCT/EP2016/082774 20161228; EPPCT/EP2016/082778 20161228; EPPCT/EP2016/082781 20161228; EPPCT/EP2016/082770 20161228
  • Main IPC: C08B37/00
  • IPC: C08B37/00 ;  C08B37/08 ;  C08L5/00 ;  C08J3/075
METHOD FOR CLEAVING AMIDE BONDS
Abstract:
a) providing a molecule comprising an amide group; b) reacting the molecule comprising an amide group with a hydroxylamine salt to cleave the amide bond of the amide group.
Abstract(Chinese):

a）提供包含酰胺基团的分子; b）使包含酰胺基团的分子与羟胺盐反应以切割酰胺基团的酰胺键。

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