Invention Application
WO2018086795A1 METHOD FOR DETERMINING AN OPTIMIZED SET OF MEASUREMENT LOCATIONS FOR MEASUREMENT OF A PARAMETER OF A LITHOGRAPHIC PROCESS, METROLOGY SYSTEM AND COMPUTER PROGRAM PRODUCTS FOR IMPLEMENTING SUCH METHODS
审中-公开
用于确定用于实施这些方法的用于测量光刻过程，计量系统和计算机程序产品的参数的测量位置的优化集合的方法
- Patent Title: METHOD FOR DETERMINING AN OPTIMIZED SET OF MEASUREMENT LOCATIONS FOR MEASUREMENT OF A PARAMETER OF A LITHOGRAPHIC PROCESS, METROLOGY SYSTEM AND COMPUTER PROGRAM PRODUCTS FOR IMPLEMENTING SUCH METHODS
- Patent Title (中): 用于确定用于实施这些方法的用于测量光刻过程，计量系统和计算机程序产品的参数的测量位置的优化集合的方法
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Application No.: PCT/EP2017/074439Application Date: 2017-09-27
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Publication No.: WO2018086795A1Publication Date: 2018-05-17
- Inventor: TEN BERGE, Peter , DE RUITER, Christiaan, Theodoor
- Applicant: ASML NETHERLANDS B.V.
- Applicant Address: P.O. Box 324 5500 AH Veldhoven NL
- Assignee: ASML NETHERLANDS B.V.
- Current Assignee: ASML NETHERLANDS B.V.
- Current Assignee Address: P.O. Box 324 5500 AH Veldhoven NL
- Agency: PETERS, John
- Priority: EP16198271.5 20161110
- Main IPC: G03F7/20
- IPC: G03F7/20
Abstract:
Disclosed is a method, and associated system for determining an optimized set of measurement locations for measurement of a parameter related to a structure applied to a substrate by a lithographic process. The method comprises determining a first set of parameter values from a first set of measurements of first structures across a first plurality of locations, for example from target measurements and determining a second set of parameter values from a second set of measurements of second structures across a second plurality of locations, for example using an SEM or e-beam tool on product structures. A correlation is determined between said first set of parameter values and said second set of parameter values and used to determine the optimized set of measurement locations.
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