公开(公告)号：WO2018086795A1

公开(公告)日：2018-05-17

申请号：PCT/EP2017/074439

申请日：2017-09-27

Applicant: ASML NETHERLANDS B.V.

Inventor： TEN BERGE, Peter ,  DE RUITER, Christiaan, Theodoor

IPC: G03F7/20

Abstract: Disclosed is a method, and associated system for determining an optimized set of measurement locations for measurement of a parameter related to a structure applied to a substrate by a lithographic process. The method comprises determining a first set of parameter values from a first set of measurements of first structures across a first plurality of locations, for example from target measurements and determining a second set of parameter values from a second set of measurements of second structures across a second plurality of locations, for example using an SEM or e-beam tool on product structures. A correlation is determined between said first set of parameter values and said second set of parameter values and used to determine the optimized set of measurement locations.

Abstract translation: 公开了用于确定用于测量与通过光刻工艺应用于衬底的结构有关的参数的测量位置的优化组的方法和相关系统。 该方法包括例如根据目标测量值从第一多个位置上的第一结构的第一组测量结果确定第一组参数值，并且确定来自第二组结构中的第二结构的第二组测量值的第二组参数值 第二多个位置，例如在产品结构上使用SEM或电子束工具。 确定所述第一组参数值和所述第二组参数值之间的相关性，并将其用于确定最佳的一组测量位置。

公开(公告)号：WO2018202361A1

公开(公告)日：2018-11-08

申请号：PCT/EP2018/058096

申请日：2018-03-29

Applicant: ASML NETHERLANDS B.V.

Inventor： YPMA, Alexander ,  TABERY, Cyrus, Emil ,  VAN GORP, Simon, Hendrik, Celine ,  LIN, Chenxi ,  SONNTAG, Dag ,  CEKLI, Hakki, Ergun ,  ALVAREZ SANCHEZ, Ruben ,  LIU, Shih-Chin ,  HASTINGS, Simon, Philip, Spencer ,  MENCHTCHIKOV, Boris ,  DE RUITER, Christiaan, Theodoor ,  TEN BERGE, Peter ,  LERCEL, Michael, James ,  DUAN, Wei ,  GUITTET, Pierre-Yves, Jerome, Yvan

IPC: G03F7/20

Abstract: A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including measured electrical characteristics from previously processed substrates and process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.