Invention Application
- Patent Title: TRANSMISSION LINES USING BENDING FINS FROM LOCAL STRESS
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Application No.: PCT/US2016/069538Application Date: 2016-12-30
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Publication No.: WO2018125226A1Publication Date: 2018-07-05
- Inventor: RAMASWAMY, Rahul , JAN, Chia-Hong , HAFEZ, Walid , DIAS, Neville , CHANG, Hsu-Yu , OLAC-VAW, Roman W. , LEE, Chen-Guan
- Applicant: INTEL CORPORATION
- Applicant Address: 2200 Mission College Boulevard Santa Clara, California 94054 US
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: 2200 Mission College Boulevard Santa Clara, California 94054 US
- Agency: BRASK, Justin, K. et al.
- Main IPC: H01P3/12
- IPC: H01P3/12 ; H01P3/123
Abstract:
Embodiments of the invention include an electromagnetic waveguide and methods of forming electromagnetic waveguides. In an embodiment, the electromagnetic waveguide may include a first semiconductor fin extending up from a substrate and a second semiconductor fin extending up from the substrate. The fins may be bent towards each other so that a centerline of the first semiconductor fin and a centerline of the second semiconductor fin extend from the substrate at a non-orthogonal angle. Accordingly, a cavity may be defined by the first semiconductor fin, the second semiconductor fin, and a top surface of the substrate. Embodiments of the invention may include a metallic layer and a cladding layer lining the surfaces of the cavity. Additional embodiments may include a core formed in the cavity.
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