A microelectronic package may be fabricated with a microelectronic substrate, a microelectronic die electrically attached to the microelectronic substrate, and an electromagnetic interference shield layer contacting one or both of the microelectronic substrate and the microelectronic die, wherein the electromagnetic interference shield layer has an electrical conductivity between about 10,000 siemens per meter and 100,000 siemens per meter. The specific range of electrical conductivity results in electromagnetic fields either generated by the microelectronic die or generated by components external to the microelectronic package scattering within the electromagnetic interference shield layer and attenuating. Thus, the electromagnetic interference shield layer can prevent electromagnetic field interference without the need to be grounded.