Invention Application
- Patent Title: MAGNETIC CORE INDUCTORS
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Application No.: PCT/US2017/053859Application Date: 2017-09-28
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Publication No.: WO2019066832A1Publication Date: 2019-04-04
- Inventor: ZHAO, Junnan , WANG, Ying , XU, Cheng , LEE, Kyu Oh , LI, Sheng , DENG, Yikang
- Applicant: INTEL CORPORATION
- Applicant Address: 2200 Mission College Boulevard Santa Clara, California 95054-1549 US
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: 2200 Mission College Boulevard Santa Clara, California 95054-1549 US
- Agency: MOORE Michael S.
- Main IPC: H01F27/00
- IPC: H01F27/00 ; H01F41/00
Abstract:
Described herein are magnetic core inductors (MCI) and methods for manufacturing magnetic core inductors. A first embodiment of the MCI can be a snake-configuration MCI. The snake-configuration MCI can be formed by creating an opening in a base material, such as copper, and providing a nonconductive magnetic material in the opening. The inductor can be further formed by forming plated through holes into the core material. The conductive elements for the inductor can be formed in the plated through holes. The nonconductive magnetic material surrounds each conductive element and plated through hole. In embodiments, a layered coil inductor can be formed by drilling a laminate to form a cavity through the laminate within the metal rings of the layered coil inductor. The nonconductive magnetic material can be provided in the cavity.
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F27/00 | 变压器或电感器的一般零部件 |