Invention Application
- Patent Title: INITIALIZATION PROCESS FOR MAGNETIC RANDOM ACCESS MEMORY (MRAM) PRODUCTION
-
Application No.: PCT/US2018/059803Application Date: 2018-11-08
-
Publication No.: WO2019099274A1Publication Date: 2019-05-23
- Inventor: LEE, Yuan-Jen , JAN, Guenole , LIU, Huanlong , ZHU, Jian
- Applicant: HEADWAY TECHNOLOGIES, INC.
- Applicant Address: 678 South Hillview Drive Milpitas, CA 95032 US
- Assignee: HEADWAY TECHNOLOGIES, INC.
- Current Assignee: HEADWAY TECHNOLOGIES, INC.
- Current Assignee Address: 678 South Hillview Drive Milpitas, CA 95032 US
- Agency: ACKERMAN, Stephen B.
- Priority: US15/818,148 20171120
- Main IPC: G11C11/16
- IPC: G11C11/16
Abstract:
An initialization process is disclosed for a perpendicular magnetic tunnel junction (p-MTJ) wherein the switching error rate is reduced from a typical range of 30-100 ppm to less than 10 ppm. In one embodiment, an in-plane magnetic field is applied after a final anneal step is performed during memory device fabrication such that all magnetizations in the free layer, and AP1 and AP2 pinned layers are temporarily aligned "in-plane". After the applied field is removed, interfacial perpendicular magnetic anisotropy (PMA) at a tunnel barrier/API interface induces a single AP1 magnetic domain with a magnetization in a first vertical direction. Interfacial PMA at a FL/tunnel barrier interface affords a single FL domain with magnetization in the first direction or opposite thereto. AP2 magnetization is opposite to the first direction as a result of antiferromagnetic coupling with the AP1 layer. Alternatively, a perpendicular- to-plane magnetic field may be applied for initialization.
Information query