The invention relates to a method for producing a sandwich arrangement consisting of a first component having a contact surface A, a second component having a contact surface D, and solder between the contact surfaces A and D, the solder being produced, by melting, from a solder preform comprising discrete contact surfaces B and C, and subsequent cooling of the molten solder at the solidification temperature thereof, the solder preform being fixed to the contact surfaces A and/or D, before the melting, with the contact surfaces B and/or C thereof, by means of an applied fixing agent consisting of a fixing agent composition, and the contact surface A is arranged facing the contact surface B and the contact surface C is arranged facing the contact surface D.