Invention Application
- Patent Title: THERMALLY CONDUCTIVE COMPOSITION AND METHODS AND DEVICES IN WHICH SAID COMPOSITION IS USED
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Application No.: PCT/CN2018/114267Application Date: 2018-11-07
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Publication No.: WO2020093258A1Publication Date: 2020-05-14
- Inventor: HU, Xiaolian , ZHANG, Jiguang , ZHENG, Yan , CHEN, Hongyu , CHEN, Chen , BHAGWAGAR, Dorab , HANSEN, Darren
- Applicant: DOW GLOBAL TECHNOLOGIES LLC , DOW SILICONES CORPORATION , HU, Xiaolian , ZHANG, Jiguang , ZHENG, Yan , CHEN, Hongyu , CHEN, Chen , BHAGWAGAR, Dorab , HANSEN, Darren
- Applicant Address: 2040 Dow Center Midland, Michigan 48674 US
- Assignee: DOW GLOBAL TECHNOLOGIES LLC,DOW SILICONES CORPORATION,HU, Xiaolian,ZHANG, Jiguang,ZHENG, Yan,CHEN, Hongyu,CHEN, Chen,BHAGWAGAR, Dorab,HANSEN, Darren
- Current Assignee: DOW GLOBAL TECHNOLOGIES LLC,DOW SILICONES CORPORATION,HU, Xiaolian,ZHANG, Jiguang,ZHENG, Yan,CHEN, Hongyu,CHEN, Chen,BHAGWAGAR, Dorab,HANSEN, Darren
- Current Assignee Address: 2040 Dow Center Midland, Michigan 48674 US
- Agency: SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC
- Main IPC: C08L83/04
- IPC: C08L83/04 ; C08K3/38 ; C08K3/28 ; C08K7/00 ; H01L23/36 ; H05K7/20
Abstract:
A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 μm, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 μm, (D-3) boron nitride having a mean size of from 20 to 200 μm.
Information query
