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公开(公告)号：WO2022099432A1
公开(公告)日：2022-05-19
申请号：PCT/CN2020/127668
申请日：2020-11-10
Applicant: DOW SILICONES CORPORATION , ZHENG, Yan , BHAGWAGAR, Dorab , HANSEN, Darren , WEI, Peng , WU, Han Guang
Inventor： ZHENG, Yan , BHAGWAGAR, Dorab , HANSEN, Darren , WEI, Peng , WU, Han Guang
Abstract: A composition contains: (a) curable silicone composition including: (i) a vinyldimethylsiloxy-terminated polydimethylpolysiloxane with a viscosity of 30 to 400mPa*s; (ii) a SiH functional crosslinker; and (iii) a hydrosilylation catalyst; where the molar ratio of crosslinker SiH functionality to vinyl functionality is 0.5: 1 to 1: 1; (b) alkyl trialkoxysilane and/or a mono-trialkoxysiloxy terminated dimethylpolysiloxane treating agent; (c) filler mix containing: (i) 40 wt%or more of spherical and irregular shaped AlN particles, both having an average size of 30 micrometers or more, the spherical AlN fillers are 40-60 wt%of the weight of the AlN fillers; (ii) 25-35 wt%spherical Al 2O 3 particles with an average size of 1-5 micrometers; (iii) 10-15 wt%of additional thermally conductive filler with a 0.1-0.5 micrometer average size; and (iv) optionally, BN fillers having an average size greater than 20 micrometers; where filler mix is 90-97 wt%and wt%is relative to composition weight unless otherwise stated.
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公开(公告)号：WO2022000166A1
公开(公告)日：2022-01-06
申请号：PCT/CN2020/098835
申请日：2020-06-29
Applicant: DOW GLOBAL TECHNOLOGIES LLC , DOW SILICONES CORPORATION , CHEN, Yu , HANSEN, Darren, Michael , MENG, Qingwei , XING, Chong , CHEN, Tingting , FENG, Shaoguang
Inventor： CHEN, Yu , HANSEN, Darren, Michael , MENG, Qingwei , XING, Chong , CHEN, Tingting , FENG, Shaoguang
IPC: C08G18/72 , C08G18/00 , C08L75/00 , C09K5/14 , C09K3/22 , C08G18/003 , C08G18/0885 , C08G18/10 , C08G18/3206 , C08G18/36 , C08G18/48 , C08G18/4812 , C08G18/4825 , C08G18/4829 , C08G18/4887 , C08G18/6696 , C08G18/7664 , C08G18/7671 , C09J175/08
Abstract: A composition comprising an isocyanate composition comprising a polyisocyanate and a specific thermally conductive filler composition (C) can further be part of a two-component curable composition comprising the isocyanate composition and a polyol composition and having a low viscosity upon admixing and upon cure provides a high thermal conductivity.
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3.发明申请
公开(公告)号：WO2020133374A1
公开(公告)日：2020-07-02
申请号：PCT/CN2018/125408
申请日：2018-12-29
Applicant: DOW GLOBAL TECHNOLOGIES LLC , DOW SILICONES CORPORATION , HU, Xiaolian , ZHANG, Jiguang , ZHENG, Yan , CHEN, Hongyu , CHEN, Chen , BHAGWAGAR, Dorab , HANSEN, Darren
Inventor： HU, Xiaolian , ZHANG, Jiguang , ZHENG, Yan , CHEN, Hongyu , CHEN, Chen , BHAGWAGAR, Dorab , HANSEN, Darren
Abstract: A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 1 μm, (D-2) middle-sized filler having a mean size of from 1 to 10 μm, (D-3) large filler having a mean size of larger than 30 μm and comprising at least magnesium oxide.
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4.发明申请
公开(公告)号：WO2020093258A1
公开(公告)日：2020-05-14
申请号：PCT/CN2018/114267
申请日：2018-11-07
Applicant: DOW GLOBAL TECHNOLOGIES LLC , DOW SILICONES CORPORATION , HU, Xiaolian , ZHANG, Jiguang , ZHENG, Yan , CHEN, Hongyu , CHEN, Chen , BHAGWAGAR, Dorab , HANSEN, Darren
Inventor： HU, Xiaolian , ZHANG, Jiguang , ZHENG, Yan , CHEN, Hongyu , CHEN, Chen , BHAGWAGAR, Dorab , HANSEN, Darren
Abstract: A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 μm, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 μm, (D-3) boron nitride having a mean size of from 20 to 200 μm.
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