- 专利标题： DESIGN-ASSISTED INSPECTION FOR DRAM AND 3D NAND DEVICES
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申请号： PCT/US2020/046257申请日： 2020-08-13
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公开(公告)号： WO2021034623A1公开(公告)日： 2021-02-25
- 发明人: HUANG, Junqing (Jenny) , LEE, Hucheng , PARK, Sean Sangbong , LI, Xiaochun
- 申请人： KLA CORPORATION
- 申请人地址： Legal Department
- 专利权人： KLA CORPORATION
- 当前专利权人： KLA CORPORATION
- 当前专利权人地址： Legal Department
- 代理机构： MCANDREWS, Kevin et al.
- 优先权： US16/542,376 2019-08-16
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; G01N21/95 ; H01L27/115 ; H01L27/108
摘要：
With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.
IPC分类:
