Disclosed is a high-frequency, low-loss, adhesive-free flexible copper clad laminate (100), comprising two layers of copper foil (1) arranged at the top and bottom, fluorine resin films (2) respectively formed on inner surfaces of the two copper foils (1), and a polyimide film (3) arranged between the upper and lower fluorine resin films (2). The fluorine resin film (2) is a film layer formed by coating a fluorine resin coating solution on the copper foil (1), where the film layer has a thickness of 3-50 μm. The fluorine resin film (2) has a melting temperature of ≥ 290°C. The peeling strength of the fluorine resin film (2) with respect to the copper foil (1) is greater than 1.0 kg/cm, while the peeling strength of the fluorine resin film (2) with respect to the polyimide film (3) is greater than 0.6 kg/cm. The thickness ratio of the fluorine resin film (2) with respect to the polyimide film (3) is 1:4 to 2:1. The flexible copper clad laminate (100) has a dielectric constant of less than 3.0 and a dielectric loss of less than 2‰ at a frequency of 20-40 GHz, a bending durability of greater than 300,000 times, and a linear expansion coefficient of less than 30 ppm. The flexible copper clad laminate is capable of reducing the loss of high-frequency signals during transmission.