Provided is a plated laminate (laminate of plated films) which is applied to the surface of a conductor circuit or the like, can maintain high joining strength when solder joining is performed on the plated laminate, and can be stably manufactured.　After a plated layer A containing a second metal as a main component is deposited on an object S to be plated containing a first metal as a main component, a plated layer B containing palladium as a main component is deposited on the plated layer A through a substitution reaction, and then a plated layer C containing nickel as a main component is deposited on the plated layer B through an oxidation‐reduction reaction. The first metal is, for example, copper. The second metal is, for example, gold, platinum, or silver.