The present invention provides a mold-type bus duct characterized by comprising: a duct; a plurality of bus bars arranged in parallel inside the duct; a plurality of fixing members which respectively support, inside the duct, the respective bus bars, and which are arranged spaced apart from each other along the longitudinal direction of the bus bars, wherein the upper ends of the fixing members are fastened to the bus bars and the lower ends thereof are fastened to the duct; and a plurality of molding parts configured to partially surround the outer sides of the respective bus bars and the upper portions of the respective fixing members, respectively. The height of each of the fixing members is 230 millimeters (mm) to 300 millimeters (mm), and the maximum surface electric field of the fixing members is 2.5 kV/mm or less when an impulse voltage of 170 kV to 187 kV is applied to the mold-type bus duct.