A flexible circuit includes a laminated substrate. The laminated substrate includes a support layer and a conductive layer made of a first metallic material arranged on the support layer. The conductive layer includes conductive traces of the first metallic material. The laminated substrate comprises a layer of a pretreatment coating deposited on the conductive traces. The flexible circuit comprises a component made of a second metallic material soldered to the conductive traces. The soldering sublimates the pretreatment coating.