公开(公告)号：WO2022072254A2

公开(公告)日：2022-04-07

申请号：PCT/US2021/052110

申请日：2021-09-27

Applicant: GENTHERM GMBH

Inventor： CIACCIO, Michael Peter

IPC: H05K1/03 ,  H05K1/14 ,  H05K3/36 ,  H05K3/04 ,  H05K3/32 ,  H05K1/0393 ,  H05K1/147 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2203/0285 ,  H05K2203/0392 ,  H05K2203/0786 ,  H05K3/043 ,  H05K3/321 ,  H05K3/363

Abstract: A flexible circuit includes a laminated substrate. The laminated substrate includes a support layer and a conductive layer made of a first metallic material arranged on the support layer. The conductive layer includes conductive traces of the first metallic material. The laminated substrate comprises a layer of a pretreatment coating deposited on the conductive traces. The flexible circuit comprises a component made of a second metallic material soldered to the conductive traces. The soldering sublimates the pretreatment coating.

公开(公告)号：WO2021222582A1

公开(公告)日：2021-11-04

申请号：PCT/US2021/029915

申请日：2021-04-29

Applicant: DUJUD LLC

Inventor： ABBASPOUR, Reza

IPC: H05K3/46 ,  H05K3/10 ,  H05K3/12 ,  H05K3/14 ,  H05K3/18 ,  B33Y30/00 ,  B33Y80/00 ,  H05K3/043 ,  H05K3/1258 ,  H05K3/1275

Abstract: Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.

公开(公告)号：WO2022005764A1

公开(公告)日：2022-01-06

申请号：PCT/US2021/037987

申请日：2021-06-18

Applicant: GENTHERM GMBH

Inventor： CIACCIO, Michael Peter

IPC: H05K1/18 ,  H05K3/04 ,  H05K1/0393 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/09872 ,  H05K2201/09909 ,  H05K2201/10272 ,  H05K2203/0228 ,  H05K2203/0285 ,  H05K3/0058 ,  H05K3/043 ,  H05K3/28 ,  H05K3/284 ,  H05K3/328 ,  H05K3/341 ,  H05K3/361

Abstract: A method of manufacturing a flexible circuit comprises providing a laminated substrate that includes a conductive layer, an adhesive layer, and a support layer. The method comprises forming conductive traces by removing selected portions of the conductive layer and the adhesive layer by dry milling the laminated substrate. The method comprises applying a protective coating to the conductive traces. The method comprises dispensing a solder material on the protective coating at a first connection point and arranging a first component at the first connection point. The method comprises heating the solder material to remove the protective coating from the first connection point and to connect the first component to one of the conductive traces at the first connection point. The method comprises attaching a second component to the conductive layer at a second connection point that is free of the protective coating by a process other than soldering.

公开(公告)号：WO2021096717A8

公开(公告)日：2021-05-20

申请号：PCT/US2020/058536

申请日：2020-11-02

Applicant: RAYTHEON COMPANY

Inventor： SIKINA, Thomas, V. ,  HAVEN, John, P. ,  WILDER, Kevin ,  BENEDICT, James, E. ,  SOUTHWORTH, Andrew, R. ,  HERNDON, Mary, K.

IPC: H01Q21/06 ,  B33Y80/00 ,  H05K3/12 ,  H01Q1/52 ,  H01Q3/40 ,  H01Q1/241 ,  H01Q1/523 ,  H01Q1/528 ,  H01Q21/0087 ,  H01Q21/065 ,  H05K2201/10098 ,  H05K2201/10287 ,  H05K3/0044 ,  H05K3/043 ,  H05K3/4038

Abstract: A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (RGB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.