Disclosed is a contact apparatus for electrical connection of two conductors such as two printed circuit boards. The contact apparatus comprises a first contact element for connecting with a first conductor, the first contact element having a first transmitting surface, a second contact element for connecting with a second conductor, the second contact element having a second transmitting surface, and a wave-like transmitting element sandwiched between the first transmitting surface and the second transmitting surface for transmitting electric current between the first contact element and the second contact element. Achieved is a high current electrical connection of simple, compact, and reliable design suitable for robotic manufacture.