Invention Application
- Patent Title: MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
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Application No.: PCT/US2021/051902Application Date: 2021-09-24
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Publication No.: WO2022139925A1Publication Date: 2022-06-30
- Inventor: KARHADE, Omkar G. , SUN, Xiaoxuan , DESHPANDE, Nitin A. , AGRAHARAM, Sairam
- Applicant: INTEL CORPORATION
- Applicant Address: 2200 Mission College Boulevard
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: 2200 Mission College Boulevard
- Agency: FEUSTEL, Alisha
- Priority: US17/129,135 2020-12-21
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/00
Abstract:
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
Information query
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