Invention Application
- Patent Title: LED CHIP-TO-CHIP VERTICALLY LAUNCHED OPTICAL COMMUNICATIONS WITH OPTICAL FIBER
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Application No.: PCT/US2022/071002Application Date: 2022-03-07
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Publication No.: WO2022187869A1Publication Date: 2022-09-09
- Inventor: PEZESHKI, Bardia , KALMAN, Robert , TSELIKOV, Alexander , DANESH, Cameron
- Applicant: AVICENATECH CORP.
- Applicant Address: 1130 Independence Ave.
- Assignee: AVICENATECH CORP.
- Current Assignee: AVICENATECH CORP.
- Current Assignee Address: 1130 Independence Ave.
- Agency: CAVANAGH, Daniel M. et al.
- Priority: US63/157,413 2021-03-05
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L23/00 ; G02B6/42 ; G02B6/43 ; H01L33/60
Abstract:
Multi-chip modules in different semiconductor packages may be optically data coupled by way of LEDs and photodetectors linked by a multicore fiber. The multicore fiber may pass through apertures in the semiconductor packages, with an array of LEDs and photodetectors in the semiconductor package providing and receiving, respectively, optical signals comprised of data passed between the multi-chip modules.
Information query
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