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公开(公告)号:WO2023284399A1
公开(公告)日:2023-01-19
申请号:PCT/CN2022/093063
申请日:2022-05-16
Applicant: 苏州旭创科技有限公司
Abstract: 本公开涉及一种基于光学相控阵列的波束控制器。所述波束控制器包括光学相控阵列、自由空间合束区和共享光栅发射器。光学相控阵列包括:分束器以及与分束器耦接的波导阵列。分束器被配置为将初始光束等分为多个子波束。波导阵列包括:与子波束一一对应设置的多个波导。波导被配置为接收并传输子波束。多个波导的传输尾段呈扇形集中于自由空间合束区。自由空间合束区被配置为:使多个子波束合成于像面上。共享光栅发射器被配置为:将多个子波束合成于像面上的合成光束衍射发射。所述波束控制器能够控制合成光束在实现大角度出射的同时具有较高的扫描输出效率。
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公开(公告)号:WO2022266676A2
公开(公告)日:2022-12-22
申请号:PCT/US2022/073039
申请日:2022-06-17
Applicant: CELESTIAL AI INC.
Inventor: WINTERBOTTOM, Philip , BOS, Martinus
IPC: G06N3/063 , G02B6/42 , G02B6/43 , G06F7/78 , G06F9/00 , G06N3/04 , G06N20/00 , H04Q11/00 , G02B6/12002 , G02B6/12004 , G02B6/30 , G02B6/34 , G06F7/50 , G06F7/5318 , G06F7/5443 , G06N3/067 , G06N3/0675
Abstract: Various embodiments provide for a circuit package including an electronic integrated circuit comprising a plurality of processing elements, and a plurality of bidirectional photonic channels, e.g., implemented in a photonic integrated circuit underneath the electronic integrated circuit, that connect the processing elements into an electro-photonic network. The processing elements include message routers with photonic-channel interfaces. Each bidirectional photonic channel interfaces at one end with a photonic-channel interface of the message router of a first one of the processing elements and at the other end with a photonic-channel interface of the message router of a second one of the processing elements and is configured to optically transfer messages (e.g., packets) between the message routers of the first and second processing elements.
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公开(公告)号:WO2022266376A1
公开(公告)日:2022-12-22
申请号:PCT/US2022/033870
申请日:2022-06-16
Applicant: NUBIS COMMUNICATIONS, INC.
Inventor: WINZER, Peter Johannes , PUPALAIKIS, Peter James , SAWYER, Brett Michael Dunn , ZHANG, Ron , GILES, Clinton Randy
Abstract: A system includes a housing having a front panel, a substrate positioned at a distance from the front panel, and a data processor mounted on the substrate. The system includes a pluggable module having an optical module, at least one first optical connector, a first fiber optic cable optically coupled between the optical module and the first optical connector, and a fiber guide that is positioned between the optical module and the first optical connector and provides mechanical support for the optical module and the first optical connector. The optical module receives optical signals from the first optical connector and generates electrical signals based on the received optical signals, and the electrical signals are transmitted to the data processor. The pluggable module has a shape that enables the pluggable module to pass through an opening in the front panel to enable the optical module to be coupled to the substrate.
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公开(公告)号:WO2022225633A1
公开(公告)日:2022-10-27
申请号:PCT/US2022/021314
申请日:2022-03-22
Applicant: INTEL CORPORATION
Inventor: KARHADE, Omkar G. , LI, Xiaoqian , IBRAHIM, Tarek A. , MAHAJAN, Ravindranath Vithal , DESHPANDE, Nitin A.
Abstract: Photonic packages and device assemblies that include photonic integrated circuits (PICs) coupled to optical lenses on lateral sides of the PICs. An example photonic package comprises a package support, an integrated circuit (IC), an insulating material, a PIC having an active side and a lateral side substantially perpendicular to the active side. At least one optical structure is on the active side. A substantial portion of the active side is in contact with the insulating material, and the PIC is electrically coupled to the package support and to the IC. The photonic package further includes an optical lens coupled to the PIC on the lateral side. In some embodiments, the photonic package further includes an interposer between the PIC or the IC and the package support.
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公开(公告)号:WO2022187869A1
公开(公告)日:2022-09-09
申请号:PCT/US2022/071002
申请日:2022-03-07
Applicant: AVICENATECH CORP.
Inventor: PEZESHKI, Bardia , KALMAN, Robert , TSELIKOV, Alexander , DANESH, Cameron
IPC: H01L25/075 , H01L23/00 , G02B6/42 , G02B6/43 , H01L33/60
Abstract: Multi-chip modules in different semiconductor packages may be optically data coupled by way of LEDs and photodetectors linked by a multicore fiber. The multicore fiber may pass through apertures in the semiconductor packages, with an array of LEDs and photodetectors in the semiconductor package providing and receiving, respectively, optical signals comprised of data passed between the multi-chip modules.
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公开(公告)号:WO2022177866A1
公开(公告)日:2022-08-25
申请号:PCT/US2022/016370
申请日:2022-02-15
Applicant: CORNING RESEARCH & DEVELOPMENT CORPORATION
Inventor: TOWERY, Taylor Buckley
Abstract: An optical communication cable and related method is provided. The cable includes a cable body and a plurality of optical transmission elements surrounded by the cable body. The cable includes a reinforcement layer surrounding the plurality of optical transmission elements and located between the cable body and the plurality of optical transmission elements. The reinforcement layer includes a first portion and a second portion coupled together and extending longitudinally away from each other.
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公开(公告)号:WO2022071108A1
公开(公告)日:2022-04-07
申请号:PCT/JP2021/035049
申请日:2021-09-24
Applicant: 日東電工株式会社
Abstract: 光導波路のミラー位置に精度よく光素子を実装することのできる光電気混載基板を提供するため、第1の面に光素子を実装するための端子3を有する電気回路基板2と、上記電気回路基板2の第2の面に設けられ上記光素子と光結合するためのミラー4を有する光導波路1とを備え、上記電気回路基板2の端子3を有する面に、上記光導波路1のミラー4を経由して出射される光の出射面Qの位置を特定するためのアライメントマーク5が形成されるようにした。
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公开(公告)号:WO2021247108A2
公开(公告)日:2021-12-09
申请号:PCT/US2021/020815
申请日:2021-03-04
Applicant: ANALOG PHOTONICS LLC
Inventor: MOSS, Benjamin Roy , TIMURDOGAN, Erman , POULTON, Christopher Vincent , SHAHRAMIAN, Shahriar
IPC: G02B6/12 , G02B6/43 , G02B6/122 , G02F1/0121 , G02F2203/50
Abstract: Controlling an optical phased array includes applying optical phase shifts by an array of phase shifter (PS) elements, each PS element applying an optical phase shift based on an input voltage signal applied across first and second terminals of the PS element, providing output voltage signals from an array of driver elements. During a charging time period, each driver element provides an output voltage signal to determine a corresponding input voltage signal applied across at least one of the PS elements; an array of switches control connectivity between the driver elements and respective PS elements; and all of the second terminals of all of the PS elements in the array of PS elements are maintained at a common voltage. The total number of switches in the array of switches is at least as large as the total number of PS elements in the array of PS elements.
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公开(公告)号:WO2021245701A1
公开(公告)日:2021-12-09
申请号:PCT/IN2021/050538
申请日:2021-06-03
Applicant: LIGHTSPEEDAI LABS PRIVATE LIMITED
Inventor: YELURIPATI, Rohin Kumar , PAMIDIGHANTAM, Venkata Ramana
IPC: G02B6/42 , G02B6/12 , H04B10/67 , H04J14/00 , G02B6/4202 , G02B6/4214 , G02B6/4249 , G02B6/43
Abstract: The invention discloses a system and method for enabling construction and assembly of an optics based compute system. The method comprises transmitting one or more signals from at least one of a plurality of components placed on an interposer (317) of a hybrid 3D transceiving module, controlling, by a processor, an optical channel based on the transmitted one or more signals, enabling inter module and intra module, reception of the one or more transmitted signals and providing, a high data rate computing performance based on the optical channel enabled inter module and intra module reception of the one or more transmitted signals associated with a hybrid 3D transceiving module. The optics based compute system comprises electrical bumps (311a to 311o), interposer (317), glass block (321), a switch IC (301), associated with a LASER driver (303), a LASER (305), TIA (307) and a PIN diode (309).
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