发明申请
- 专利标题： MODULE-LESS SUB-PACK DESIGN
-
申请号： PCT/US2022/031606申请日： 2022-05-31
-
公开(公告)号： WO2022251738A1公开(公告)日： 2022-12-01
- 发明人: RIEGELS, Daniel
- 申请人： CUMMINS INC. , JHA, Pallav
- 申请人地址： 500 Jackson Street; 5560 Treeline Drive
- 专利权人： CUMMINS INC.,JHA, Pallav
- 当前专利权人： CUMMINS INC.,JHA, Pallav
- 当前专利权人地址： 500 Jackson Street; 5560 Treeline Drive
- 代理机构： LINDER, Walter C.
- 优先权： US63/194,360 2021-05-28
- 主分类号： H01M50/204
- IPC分类号： H01M50/204 ; B60L50/64 ; H01M10/60 ; H01M10/658 ; H01M50/20 ; H01M50/202
摘要：
Disclosed herein are devices, systems, and methods relating to a battery pack.In an example, a battery back can include a bottom cover and a pack housing coupled to the bottom cover. The pack housing can include a plurality of slots for a plurality of individual battery cells. The battery pack can include a thermal plate positioned between the bottom cover and the pack housing. The battery pack can include adhesive disposed in the plurality of slots. The battery pack can include the plurality of individual battery cells disposed respectively in the plurality of slots. The plurality of individual battery cells can be in contact with the adhesive.
