Invention Application
- Patent Title: BIPOLAR ESC WITH BALANCED RF IMPEDANCE
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Application No.: PCT/US2022/040481Application Date: 2022-08-16
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Publication No.: WO2023023067A1Publication Date: 2023-02-23
- Inventor: LI, Jian , HAMMOND, Edward P. , ROCHA-ALVAREZ, Juan Carlos , DZILNO, Dmitry A. , ZHANG, Wenhao
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: 3050 Bowers Avenue
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: 3050 Bowers Avenue
- Agency: SPINK, Torrey et al.
- Priority: US17/405,929 2021-08-18
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; H01L21/687 ; H01J37/32
Abstract:
Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a lid plate seated on the chamber body. The lid plate may define a plurality of apertures. The systems may include a plurality of lid stacks equal to a number of the plurality of apertures. The systems may include a plurality of substrate support assemblies equal to the number of apertures defined through the lid plate. Each assembly may be disposed in one of the processing regions and may include an electrostatic chuck body defining a substrate support surface that defines a substrate seat. Each assembly may include a heater embedded within the chuck body. Each assembly may include bipolar electrodes between the heater and the substrate support surface. Each assembly may include a conductive mesh embedded within the body between the heater and bipolar electrodes.
Information query
IPC分类:
