公开(公告)号：EP1851258A1

公开(公告)日：2007-11-07

申请号：EP06719273.2

申请日：2006-01-24

申请人： CYTEC TECHNOLOGY CORP.

发明人： BOYD, Jack ,  BONGIOVANNI, Christopher, L. ,  THAI, Bryan

IPC分类号： C08F222/40 ,  C08G73/12

CPC分类号： C08F222/40 ,  C08G73/12 ,  C08G73/126

摘要： The present invention is for the use of aliphatic bismaleimide compounds in epoxy resin systems to increase the thermal aging properties of a cured resin system through reduced microcracking as measured by reduced weight loss after thermal aging. The present invention further provides a BMI resin formulation with no undissolved solid BMI, but which retains equivalent mechanical properties as BMI resin formulations incorporating slurried solid BMI particles.