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公开(公告)号：EP1851258A1
公开(公告)日：2007-11-07
申请号：EP06719273.2
申请日：2006-01-24
IPC分类号： C08F222/40 , C08G73/12
CPC分类号： C08F222/40 , C08G73/12 , C08G73/126
摘要： The present invention is for the use of aliphatic bismaleimide compounds in epoxy resin systems to increase the thermal aging properties of a cured resin system through reduced microcracking as measured by reduced weight loss after thermal aging. The present invention further provides a BMI resin formulation with no undissolved solid BMI, but which retains equivalent mechanical properties as BMI resin formulations incorporating slurried solid BMI particles.
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2.发明公开BISMALEIMIDE RESIN SYSTEM WITH IMPROVED MANUFACTURING PROPERTIES 有权BISMALEINIMIDHARZSYSTEM具有改进的制造特征
公开(公告)号：EP1874867A1
公开(公告)日：2008-01-09
申请号：EP06740344.4
申请日：2006-04-03
CPC分类号： C08G73/121 , C08K5/06 , C08L79/085 , C08L79/08
摘要： The present invention is a thermosetting bismaleimide resin system comprising a liquid phase and a solid phase where the non-crystallizing liquid phase contains the curing agents diallyl ether of a substantially aromatic radical and a bis(alkenylphenoxy) ether of a substantially aromatic radical along with a substantially aromatic bismaleimide as a particle slurry and optionally a free radical inhibitor. The curing agents are non-crystallizing compositions for use in bismaleimide resin formulations to increase the thermal durability of a cured resin composite as shown by reduced microcracking as measured by reduced weight loss after thermal aging. The present invention resists microcracking over bismaleimide resin systems which incorporate other curing agents or combinations of curing agents. The present invention further provides a bismaleimide resin formulation suitable to make prepregs with reduced crystallization for reduced viscosity supporting improved manufacturing properties and improved tack.
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3.发明授权BISMALEIMIDE RESIN SYSTEM WITH IMPROVED MANUFACTURING PROPERTIES 有权BISMALEINIMIDHARZSYSTEM具有改进的制造特征
公开(公告)号：EP1874867B1
公开(公告)日：2012-06-20
申请号：EP06740344.4
申请日：2006-04-03
CPC分类号： C08G73/121 , C08K5/06 , C08L79/085 , C08L79/08
摘要： The present invention is a thermosetting bismaleimide resin system comprising a liquid phase and a solid phase where the non-crystallizing liquid phase contains the curing agents diallyl ether of a substantially aromatic radical and a bis(alkenylphenoxy) ether of a substantially aromatic radical along with a substantially aromatic bismaleimide as a particle slurry and optionally a free radical inhibitor. The curing agents are non-crystallizing compositions for use in bismaleimide resin formulations to increase the thermal durability of a cured resin composite as shown by reduced microcracking as measured by reduced weight loss after thermal aging. The present invention resists microcracking over bismaleimide resin systems which incorporate other curing agents or combinations of curing agents. The present invention further provides a bismaleimide resin formulation suitable to make prepregs with reduced crystallization for reduced viscosity supporting improved manufacturing properties and improved tack.
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