公开(公告)号：EP1633521B1

公开(公告)日：2012-04-11

申请号：EP04739567.8

申请日：2004-06-03

申请人： Electro Scientific Industries, Inc.

发明人： GILLEN, David

IPC分类号： B23K26/18 ,  B23K26/16

CPC分类号： B23K26/18 ,  B23K26/16 ,  Y10T428/265 ,  Y10T428/31504

摘要： A surface of a workpiece (12) to be laser machined is protected by a surfactant film (11) form debris (15) produced during machining with a laser beam (14) by reducing adherence to the surface of debris produced by the laser machining. The surfactant film is preferably subsequently removed together with debris (151) deposited thereon.

公开(公告)号：EP1825507B1

公开(公告)日：2011-09-28

申请号：EP05808203.3

申请日：2005-11-01

申请人： Electro Scientific Industries, Inc.

发明人： BOYLE, Adrian ,  GILLEN, David ,  DUNNE, Kali ,  FERNANDES GOMEZ, Eva ,  TOFTNESS, Richard

IPC分类号： H01L21/78 ,  H01L21/3065

CPC分类号： H01L21/3065 ,  H01L21/78

摘要： A semiconductor wafer 11 having an active layer is mounted on a carrier 13 with the active layer away from the carrier and at least partially diced on the carrier from a major surface of the semiconductor wafer. The at least partially diced semiconductor wafer is etched on the carrier from the said major surface with a spontaneous etchant 140 to remove sufficient semiconductor material from a die produced from the at least partially diced semiconductor wafer to improve flexural bend strength of the die by removing at least some defects caused by dicing.