摘要:
A supporting electrode (16,18) is mounted on at lear,t one surface of a semiconductor substrate (11). The sides of the substrate (11) and the electrode are covered by epoxy resin (43). In order to avoid problems arising from the different thermal expansion coefficients of the various materials, the electrode is formed of a copper-carbon fiber composition metal in which carbon fibers are embedded in a spiral and lie parallel to the major surface of the substrate, so that the electrode exhibits anisotropic thermal expansion properties. Its coefficient of expansion parallel to the major surface of the substrate is lower than its coefficient in the direction perpendicular to this surface, since the expansion coefficient of the substrate (e.g. silicon) is lower than that of the resin (43),