公开(公告)号：EP3974758A1

公开(公告)日：2022-03-30

申请号：EP21193107.6

申请日：2021-08-25

申请人： INTEL Corporation

发明人： SHAIKH, Javed ,  RAJU, Prakash Kurma ,  DHANDAPANI, Kathiravan

IPC分类号： F28D15/00

摘要： In one embodiment, a system includes a chip package and a cooling apparatus coupled to the chip package. The chip package includes one or more processors, and the cooling apparatus includes a first cavity defined at least partially by a first metal wall and a second metal wall and a second cavity defined at least partially by a flat third metal wall and the second metal wall. An internal pressure of the first cavity is lower than an ambient pressure outside the sealed first cavity. The second cavity includes a liquid disposed therein and wick material coupled to an interior surface of the third wall, and the chip package is positioned such that it coupled to the flat third metal wall of the cooling apparatus.

公开(公告)号：EP4082308A1

公开(公告)日：2022-11-02

申请号：EP20904932.9

申请日：2020-12-23

申请人： INTEL Corporation

发明人： BAWA, Ritu ,  CARDENAS, Ruander ,  D, Kathiravan ,  GO, Jia Yan ,  GOH, Chin Kung ,  KU, Jeff ,  KURMA RAJU, Prakash ,  LIU, Baomin ,  LOO, Twan Sing ,  MAKINEN, Mikko Antero ,  MISHRA, Columbia ,  PAAVOLA, Juha Tapani ,  PICHUMANI, Prasanna ,  RAGLAND, Daniel ,  RAJA, Kannan ,  SEE, Khai Ern ,  SHAIKH, Javed ,  SUBRAMANIAM, Gokul ,  SUN, George Baoci ,  TIAN, Xiyong ,  YANG, Hua ,  CARBONE, Mark ,  PARANJAPE, Vivek ,  PINJARI, Nehakausar ,  THAKUR, Hari Shanker ,  MOORE, Christopher M. ,  FRICKE, Gustavo ,  HUTTULA, Justin M. ,  SUNG, Gavin ,  LIU, Sammi WY ,  SEN, Arnab ,  LIU, Tim ,  JIANG, Jason Y. ,  JUAN, Gerry ,  NIEN, Cora ,  LIN, Lance ,  KUKLINSKI, Evan Piotr

IPC分类号： H05K7/20 ,  F28D15/04