公开(公告)号：EP4082308A1

公开(公告)日：2022-11-02

申请号：EP20904932.9

申请日：2020-12-23

申请人： INTEL Corporation

发明人： BAWA, Ritu ,  CARDENAS, Ruander ,  D, Kathiravan ,  GO, Jia Yan ,  GOH, Chin Kung ,  KU, Jeff ,  KURMA RAJU, Prakash ,  LIU, Baomin ,  LOO, Twan Sing ,  MAKINEN, Mikko Antero ,  MISHRA, Columbia ,  PAAVOLA, Juha Tapani ,  PICHUMANI, Prasanna ,  RAGLAND, Daniel ,  RAJA, Kannan ,  SEE, Khai Ern ,  SHAIKH, Javed ,  SUBRAMANIAM, Gokul ,  SUN, George Baoci ,  TIAN, Xiyong ,  YANG, Hua ,  CARBONE, Mark ,  PARANJAPE, Vivek ,  PINJARI, Nehakausar ,  THAKUR, Hari Shanker ,  MOORE, Christopher M. ,  FRICKE, Gustavo ,  HUTTULA, Justin M. ,  SUNG, Gavin ,  LIU, Sammi WY ,  SEN, Arnab ,  LIU, Tim ,  JIANG, Jason Y. ,  JUAN, Gerry ,  NIEN, Cora ,  LIN, Lance ,  KUKLINSKI, Evan Piotr

IPC分类号： H05K7/20 ,  F28D15/04

公开(公告)号：EP3836272A1

公开(公告)日：2021-06-16

申请号：EP21150576.3

申请日：2015-10-08

申请人： INTEL Corporation

发明人： RAJA, Kannan ,  Keates, Andy

IPC分类号： H01M10/04 ,  H01M10/0562 ,  H01M10/0565 ,  H01M10/0585 ,  H01M10/42 ,  H01M4/134 ,  H01M50/20 ,  H01M50/216 ,  H01M50/531 ,  H05K1/16

摘要： Systems and methods are provided for battery cells including solid electrolytes. Solid electrolyte cells may be integrated with electronic devices. For example, a solid electrolyte cell may be integrated with a metal surface of a circuit board or an electrically conductive surface of a chassis. Surface-mountable solid electrolyte cells may be electrically coupled to circuit traces using, for example, a reflow soldering process.

公开(公告)号：EP3235045A1

公开(公告)日：2017-10-25

申请号：EP15870516.0

申请日：2015-10-08

申请人： Intel Corporation

发明人： KEATES, Andy ,  RAJA, Kannan

IPC分类号： H01M10/0525 ,  H01M10/0585 ,  H01M10/04 ,  H01M2/10

CPC分类号： H01M10/425 ,  H01M2/0202 ,  H01M2/1022 ,  H01M2/1044 ,  H01M2/26 ,  H01M4/134 ,  H01M10/0436 ,  H01M10/0562 ,  H01M10/0565 ,  H01M10/0585 ,  H01M2220/30 ,  H01M2300/0068 ,  H01M2300/0082 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/181 ,  H05K3/10 ,  H05K2201/10037

摘要： Systems and methods are provided for battery cells including solid electrolytes. Solid electrolyte cells may be integrated with electronic devices. For example, a solid electrolyte cell may be integrated with a metal surface of a circuit board or an electrically conductive surface of a chassis. Surface-mountable solid electrolyte cells may be electrically coupled to circuit traces using, for example, a reflow soldering process.

摘要翻译： 提供了用于包括固体电解质的电池单元的系统和方法。 固体电解质电池可以与电子设备集成。 例如，固体电解质电池可以与电路板的金属表面或底盘的导电表面集成。 使用例如回流焊接工艺可将表面可安装的固体电解质电池电耦合到电路迹线。