公开(公告)号：EP2087838A1

公开(公告)日：2009-08-12

申请号：EP08380028.4

申请日：2008-02-05

申请人： Ikerlan, S. Coop. ,  Universitat Autonoma de Barcelona ,  Consejo Superior de Investigaciones Cientificas ,  I2M-Design ,  Sociedad española de carburos metalicos, S.A.

发明人： Blanco Barro, Francisco Javier ,  Tijero Serna, Maria ,  Fernandez Ledesma, Luis Jose ,  Aguilo Llobet, Jordi ,  Villa Sanz, Rosa ,  Calderon, Enric ,  Gomez Suarez, Cristina ,  Gabriel Buguña, Gemma

IPC分类号： A61B5/04 ,  G03F7/00

CPC分类号： A61B5/04001 ,  A61B5/413 ,  A61B2562/028 ,  A61B2562/125

摘要： Metallization process to obtain a microelectrode on a photopatternable polymeric substrate comprising the steps of depositing a material with low adhesion, spin coating a negative photoresin A, Patterning its design, protecting its uncured areas, depositing a positive photoresin B, and etch away them, Patterning the electrode using photolithography, metallizing the resulting surface, Etching away the positive photoresin polymers B and B', spin-coating a negative photoresin A and finally performing the final development, hence overcoming the state of the art difficulties providing a process for obtaining a photopatterned polymeric substrate microelectrode, with the ductility required to prevent the microelectrode from breaking and the thickness required to avoid folding during the insertion.

摘要翻译： 金属化工艺，以获得在照片图案的微电极能够聚合物基材包括沉积具有低粘附力的材料，旋涂负感光树脂A，图案化的设计，保护其未固化的区域，沉积正性光树脂B的步骤，和蚀刻awaythem，图案化 使用光刻法，金属化所得表面，蚀刻掉正感光树脂聚合物B和B”的电极中，旋涂负感光树脂A和最后进行的最终发展，因此克服了用于获得photopatterned提供处理的技术困难的状态 聚合物基底的微电极，与所要求的延展性，以防止破坏微电极，并避免在插入期间折叠所需要的厚度。