公开(公告)号：EP2048251A1

公开(公告)日：2009-04-15

申请号：EP07743960.2

申请日：2007-05-23

申请人： Kabushiki Kaisha Kobe Seiko Sho

发明人： ARUGA, Yasuhiro c/o Kobe Steel, Ltd. (KCRL) ,  FUGONO, Akira c/o Chofu Plant in Kobe Steel, Ltd. ,  KUDO, Takeshi c/o Kobe Steel, Ltd. (KCRL) ,  KAJIHARA, Katsura c/o Kobe Steel, Ltd. (KCRL)

IPC分类号： C22C9/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/10 ,  C22F1/08 ,  G01N23/04 ,  H01B1/02 ,  C22F1/00 ,  H01H1/025

CPC分类号： H01B1/026 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08 ,  H01H1/025

摘要： The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% ofNi; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% ofP, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.

摘要翻译： 本发明涉及一种铜合金具有高强度，高导电率，并且弯曲加工性优异，含有该铜合金，以质量％计，0.4〜4.0％的Ni; 00:05于Si的1.0％; 并且，作为元素M，一个构件选自0.005〜0.5％OFP，将Cr的0005〜1.0％，和Ti：0.005〜1.0％，余量由铜及不可避免的杂质构成，在其中的原子数比M /硅 的元素M和Si包含在沉淀物具有在铜合金的微观结构的尺寸为50至200nm，从0点01〜10的平均值，在原子数比由场致发射透射电子显微镜下测得的30000倍 和能量色散分析仪。 。根据本发明，能够提供一种具有高强度，高导电率，并且弯曲加工性优良的铜合金。

公开(公告)号：EP2048251B1

公开(公告)日：2012-01-25

申请号：EP07743960.2

申请日：2007-05-23

申请人： Kabushiki Kaisha Kobe Seiko Sho

发明人： ARUGA, Yasuhiro c/o Kobe Steel, Ltd. (KCRL) ,  FUGONO, Akira c/o Chofu Plant in Kobe Steel, Ltd. ,  KUDO, Takeshi c/o Kobe Steel, Ltd. (KCRL) ,  KAJIHARA, Katsura c/o Kobe Steel, Ltd. (KCRL)

IPC分类号： C22C9/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/10 ,  C22F1/08 ,  G01N23/04 ,  H01B1/02 ,  C22F1/00 ,  H01H1/025

CPC分类号： H01B1/026 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08 ,  H01H1/025

摘要： A copper alloy containing 0.4 to 4.0% of Ni and 0.05 to 1.0% of Si by mass and further containing at least one element selected from the following elements as the element M: P: 0.005 to 0.5%, Cr: 0.005 to 1.0%, and Ti: 0.005 to 1.0%, with the remainder being copper and unavoidable impurities, wherein the ratio of the number of atoms of element M and that of element Si (i.e., M/Si) contained in a precipitate having a size ranging from 50 to 200 nm in the copper alloy matrix is 0.01 to 10 on average (wherein the size is measured by a field emission transmission electron microscope having a magnification of 30000 times and an energy-dispersive analysis system). The copper alloy has high strength, a high electric conductivity and excellent bending workability.