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1.发明公开Copper alloy with high strength, high electrical conductivity, and excellent bendability 有权铜合金具有高强度，高导电性和优异的可弯曲性
公开(公告)号：EP2426225A3
公开(公告)日：2013-10-02
申请号：EP11009246.7
申请日：2007-05-23
IPC分类号： C22C9/06 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/10 , C22F1/08 , G01N23/04 , H01B1/02 , C22F1/00 , H01H1/025
CPC分类号： H01B1/026 , C22C1/06 , C22C9/00 , C22C9/02 , C22C9/06 , C22C9/10 , C22F1/00 , C22F1/08 , H01H1/025
摘要： The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, 0.005 to 1.0% of Cr, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.
摘要翻译： 本发明涉及具有高强度，高导电率和优异的弯曲性的铜合金，所述铜合金以质量％计含有0.4〜4.0％的Ni; ，Si：0.05〜1.0％ 作为元素M，含有Cr：0.005〜1.0％，余量为铜和不可避免的杂质，其中，50〜200nm的析出物中含有的元素M和Si的原子数比M / Si 铜合金的微观结构平均为0.01〜10，原子数比是通过场放射透射电子显微镜以30,000倍的放大率和能量色散分析仪测量的。 根据本发明，可以提供具有高强度，高导电性和优异弯曲性的铜合金。
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2.发明公开Copper alloy with high strength, high electrical conductivity, and excellent bendability 有权具有高强度，高导电率和弯曲加工性优良的铜合金
公开(公告)号：EP2426225A2
公开(公告)日：2012-03-07
申请号：EP11009246.7
申请日：2007-05-23
IPC分类号： C22C9/06 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/10 , C22F1/08 , G01N23/04 , H01B1/02 , C22F1/00 , H01H1/025
CPC分类号： H01B1/026 , C22C1/06 , C22C9/00 , C22C9/02 , C22C9/06 , C22C9/10 , C22F1/00 , C22F1/08 , H01H1/025
摘要： The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, 0.005 to 1.0% of Cr, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.
摘要翻译： 本发明涉及一种铜合金具有高强度，高导电性，和优异的弯曲性，铜合金含有，以质量％计，0.4的Ni 4.0％; 00:05于Si的1.0％; 并且，作为元素M，0.005为Cr：1.0％，剩余部分为铜和不可避免的杂质，在其中原子数比M /的元素M和Si所含的Si在尺寸为50至200nm的析出物 该铜合金的微观结构是从0点01分〜10的平均值，在原子数比由30000和能量色散分析仪的倍率的场发射型透射电子显微镜测定。 。根据本发明，能够提供一种具有高强度，高导电率，并且弯曲加工性优良的铜合金。
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3.发明公开Copper alloy with high strength, high electrical conductivity, and excellent bendability 有权具有高强度，高导电率和弯曲加工性优良的铜合金
公开(公告)号：EP2426224A2
公开(公告)日：2012-03-07
申请号：EP11009245.9
申请日：2007-05-23
IPC分类号： C22C9/06 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/10 , C22F1/08 , G01N23/04 , H01B1/02 , C22F1/00 , H01H1/025
CPC分类号： H01B1/026 , C22C1/06 , C22C9/00 , C22C9/02 , C22C9/06 , C22C9/10 , C22F1/00 , C22F1/08 , H01H1/025
摘要： The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.
摘要翻译： 本发明涉及一种铜合金具有高强度，高导电性，和优异的弯曲性，铜合金含有，以质量％计，0.4的Ni 4.0％; 00:05于Si的1.0％; 并且，作为元素M，0.005与Ti的1.0％，余量由铜及不可避免的杂质构成，在其中的原子数比M /的元素M和Si所含的Si在尺寸为50至200nm的析出物 该铜合金的微观结构是从0点01分〜10的平均值，在原子数比由30000和能量色散分析仪的倍率的场发射型透射电子显微镜测定。 。根据本发明，能够提供一种具有高强度，高导电率，并且弯曲加工性优良的铜合金。
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4.发明授权Copper alloy with high strength, high electrical conductivity, and excellent bendability 有权铜合金具有高强度，高导电性和优异的可弯曲性
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5.发明授权Copper alloy with high strength, high electrical conductivity, and excellent bendability 有权具有高强度，高导电率和弯曲加工性优良的铜合金
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6.发明授权Copper alloy having high strength and superior bending workability, and method for manufacturing copper alloy plates 有权具有高强度和优异的弯曲性和工艺的铜合金制造铜合金板
公开(公告)号：EP2439296B1
公开(公告)日：2013-08-28
申请号：EP11008840.8
申请日：2006-06-19
发明人： Aruga, Yasuhiro , Kajhara, Katsura , Kudo, Takeshi
CPC分类号： C22F1/08 , B21B2003/005 , B22D11/004 , B22D21/025 , C22C1/06 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/05 , C22C9/06
摘要： The present invention provides a Cu-Fe-P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to 1.0% Mg, and the remainder Cu and unavoidable impurities. The size of oxides and precipitates including Mg in the copper alloy is controlled so that the ratio of the amount of Mg measured by a specified measurement method in the extracted residue by a specified extracted residue method to the Mg content in said copper alloy is 60% or less, thus endowing the alloy with a high strength and superior bending workability.
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7.发明公开Copper alloy having high strength and superior bending workability, and method for manufacturing copper alloy plates 有权具有高强度和优异的弯曲性和工艺的铜合金制造铜合金板
公开(公告)号：EP2439296A2
公开(公告)日：2012-04-11
申请号：EP11008840.8
申请日：2006-06-19
发明人： Aruga, Yasuhiro , Kajhara, Katsura , Kudo, Takeshi
CPC分类号： C22F1/08 , B21B2003/005 , B22D11/004 , B22D21/025 , C22C1/06 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/05 , C22C9/06
摘要： The present invention relates to a copper alloy having a high strength and superior bending workability, respectively containing 0.01 to 3.0% by mass of Fe, 0.01 to 0.4% by mass of P and 0.1 to 1.0% by mass of Mg, and remainder Cu and unavoidable impurities, wherein in the grain size measured by a crystal orientation analysis method in which an electron back scattering pattern system is mounted on a field emission scanning electron microscope, the mean grain size described below is 6.5 m or less, and the standard deviation of the mean grain size described below is 1.5 m or less:
wherein when n indicates the number of crystal grains measured and x indicates the grain size values measured, the mean grain size is expressed as (Σx)/n, and the standard deviation of the mean grain size is expressed as [nΣx 2 - (Σx) 2 ] / [n/(n-1) 1/2 ].摘要翻译： 本发明涉及一种具有高强度和优异的弯曲加工性，分别由镁的质量含的Fe的质量0时01％至3.0％，0点01分至0.4％的P的质量计为0.1％至1.0％的铜合金，和余量Cu和 不可避免的杂质，worin在由其中一个晶体取向分析法，以电子背散射图案系统测量的晶粒尺寸被安装在一个场发射扫描电子显微镜，下面描述的平均颗粒尺寸为6.5微米或更小，和的标准偏差 下面描述的平均颗粒尺寸为1.5微米或更小：worin当n表示测量的晶粒的数目和x表示粒径的值来衡量，上述平均晶粒直径是过表达（£X）/ n，并且标准偏差 平均粒径过表达为[N£X 2 - （£X）2] / [N /（N-1）1/2]。
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8.发明授权Pure titanium sheet excellent in balance between stamping formability and strenght 有权具有强度和Stanzformbarkeit的平衡优异纯钛板
公开(公告)号：EP2481824B1
公开(公告)日：2016-05-11
申请号：EP12000548.3
申请日：2012-01-27
CPC分类号： C22F1/183 , C22C14/00 , F28F21/086
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9.发明公开Pure titanium sheet excellent in balance between stamping formability and strenght 有权Reine Titanblech mit hervorragender平衡zwischen Stanzformbarkeit和Festigkeit
公开(公告)号：EP2481824A1
公开(公告)日：2012-08-01
申请号：EP12000548.3
申请日：2012-01-27
CPC分类号： C22F1/183 , C22C14/00 , F28F21/086
摘要： Disclosed is a pure titanium sheet having a strength corresponding to JIS Grade 2 level (215 MPa in terms of 0.2% yield strength) or more and having satisfactory stamping formability. The pure titanium sheet includes titanium and inevitable impurities, has a 0.2% yield strength of 215 MPa or more, has an average grain size d of its structure of 25 μm or more and 75 μm or less, and has a hexagonal crystal structure, in which respective grains in the hexagonal crystal structure have an average of Schmidt factors (SF) of (11-22) twins with a rolling direction as axes, and the average Schmidt factor (SF) and the average grain size d satisfy following Expression (1): 0.055 ≤ SF / √d ≤ 0.084
摘要翻译： 公开了具有对应于JIS Grade2级别（屈服强度为0.2％的215MPa）以上且具有令人满意的冲裁成形性的纯钛片。 纯钛片包括钛和不可避免的杂质，其屈服强度为0.2MPa，屈服强度为215MPa以上，其结构的平均粒径d为25μm以上且75μm以下，具有六方晶系结构， 六方晶系结构中的各晶粒的平均Schmidt因子（SF）为（11-22）双轴，轧制方向为轴，平均Schmidt因子（SF）和平均晶粒尺寸d满足下式（1 ）：0.055‰¤SF /‰¤0.084
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10.发明公开Copper alloy with high strength, high electrical conductivity, and excellent bendability 有权具有高强度，高导电率和弯曲加工性优良的铜合金
公开(公告)号：EP2426224A3
公开(公告)日：2013-10-02
申请号：EP11009245.9
申请日：2007-05-23
IPC分类号： C22C9/06 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/10 , C22F1/08 , G01N23/04 , H01B1/02 , C22F1/00 , H01H1/025
CPC分类号： H01B1/026 , C22C1/06 , C22C9/00 , C22C9/02 , C22C9/06 , C22C9/10 , C22F1/00 , C22F1/08 , H01H1/025
摘要： The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.
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